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The Asia Pacific region is witnessing robust growth owing to the rapid industrialisation and digitalisation in the region. The advent of the Internet of things (IoT) and artificial intelligence (AI) in emerging economies like India and China are bolstering the market growth. Moreover, increasing investments and research and development (R&D) activities in the region are augmenting the growth of the compound semiconductor packaging industry. Furthermore, the market growth in the region can be attributed to the thriving automotive industry. The region is one of the biggest producers and consumers of the automotive sector, which, in turn, is surging the demand for compound semiconductor packaging. In addition, the extensive production of consumer electronics is positively impacting the market growth. The development of advanced and innovative products in technologically advanced countries like South Korea, Japan, and China are fuelling the market growth, hence contributing to the overall industry growth.
KLA Corporation (NASDAQ: KLAC), one of the leading players in the market, announced the launch of the Kronos 1190 wafer-level packaging inspection system, the ICOS F160XP, and the next generation of ICOS T3/T7 Series in September 2020. Through the systems, the company advances semiconductor device fabrication at the packaging stage by addressing the complexities of shrinking feature sizes, heterogeneous integration, and 3D structures. This would enable consumers to improve device performance without relying on scaling silicon design nodes. It also improves yield and quality assurance to advance technologies and cost roadmaps for consumers. The systems offer device manufacturers, foundries, and outsourced semiconductor and test providers to meet the demand for high-quality, diverse, and reliable products. The development of such systems is anticipated to aid the market growth.
Market Analysis by Packaging Platform, Application, End Use, and Region:
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The major players in the global market for compound semiconductor packaging are Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Deca Technologies, Jiangsu Changjiang Electronics Technology Co., Ltd, and KLA Corporation, among others. The comprehensive report by EMR looks into the market share, capacity, and latest developments like mergers and acquisitions, plant turnarounds, and capacity expansions of the major players.
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