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The global compound semiconductor packaging market attained a value of about USD 15.86 billion in 2022. The market is further expected to grow in the forecast period of 2023-2028 at a CAGR of 11.3% to reach nearly USD 30.23 billion by 2028.
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The advent of the 5G technology and surging internet penetration are increasing the use of compound semiconductors, such as gallium nitride (GaN) and silicon carbide (SiC). Moreover, the use of compound semiconductors as a substitute for silicon-based materials due to global shortage of semiconductors is propelling the industry growth. Compound semiconductors provide high temperature, high-pressure resistance, and high efficiency, due to which they are increasingly used in various electronic components. This, in turn, is increasing the applications of compound semiconductor packaging, which is invigorating the industry growth.
The rising integration of the Internet of things (IoT) in various applications is fuelling the growth of the compound semiconductor packaging industry. The advent of smart homes and smart buildings is surging the integration of compound semiconductors to increase operational efficiency and functionality of numerous components, consequently boosting the industry growth. In addition, they enhance the efficiency of sensors to collect operational data and enable automation, due to which they are increasingly deployed in smart homes and buildings. They also protect the infrastructure from cyberattacks by providing embedded security solutions, hence providing impetus to the growth of the compound semiconductor packaging industry.
A compound semiconductor packaging is the packaging of compound semiconductors to connect them to electronic components while protecting them from the external environment. The packaging material used is typically made up of glass, plastic, metal, or ceramic to provide corrosion and moisture resistance to compound semiconductors.
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The major packaging platforms of compound semiconductor packaging are:
The market can be broadly categorised on the basis of its applications into:
Based on end uses, the market is divided into:
The EMR report looks into the regional markets of compound semiconductor packaging like North America, Europe, the Asia Pacific, the Middle East and Africa, and Latin America.
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The technological evolution and electrification of automobiles are increasing the use of compound semiconductor packaging, therefore aiding the market growth. Compound semiconductor packaging is integral to ensure the functionality and reliability of electric components. The trend of advanced packaging to meet demands for high-quality, safety, and comfortability is expected to propel the growth of the compound semiconductor packaging industry. The extensive use of compound semiconductors in electronic components of automobiles is projected to fuel the market growth. The rapid electrification of the automotive sector and the rising popularity of electric vehicles are escalating the deployment of compound semiconductor packaging in electronic power steering, digital radio tunes, and vehicle-to-vehicle communications. Such extensive uses of compound semiconductor packaging are anticipated to accelerate the industry growth.
The evolution of packaging technology which is enhancing functionality, versatility, and applications of compound semiconductor packaging while improving the performance and cost-effectiveness of electric systems, is propelling the market growth. Increasing research and development (R&D) activities to develop cost-effective and automated compound packaging platforms to enable effective packaging for compound semiconductors such as indium phosphide (InP) is projected to augment the market growth. As applications of compound semiconductors are becoming more complex, their packaging is witnessing an advancement. This is estimated to surge the deployment of compound semiconductor packaging, therefore invigorating the industry growth.
The report presents a detailed analysis of the following key players in the global compound semiconductor packaging market, looking into their capacity, market shares, and latest developments like capacity expansions, plant turnarounds, and mergers and acquisitions:
The comprehensive report looks into the macro and micro aspects of the industry. The EMR report gives an in-depth insight into the market by providing a SWOT analysis as well as an analysis of Porter’s Five Forces model.
REPORT FEATURES | DETAILS |
---|---|
Base Year | 2022 |
Historical Period | 2018-2022 |
Forecast Period | 2023-2028 |
Scope of the Report | Historical and Forecast Trends, Industry Drivers and Constraints, Historical and Forecast Market Analysis by Segment- Packaging Platform, Application, End Use, Region |
Breakup by Packaging Platform | Flip Chip, Embedded Die, Fan-in WLP, Fan-out WLP |
Breakup by Application | CS Power Electronics, CS RF/Microwave, CS Photonics, CS Sensing, CS Quantum |
Breakup by End Use | Digital Economy, Industrial and Energy & Power, Defence/Security, Transport, Consumer Electronics, Healthcare, Space |
Breakup by Region | North America, Europe, Asia Pacific, Latin America, Middle East and Africa |
Market Dynamics | SWOT, Porter's Five Forces, Key Indicators for Price and Demand |
Competitive Landscape | Market Structure, Company Profiles- Company Overview, Product Portfolio, Demographic Reach and Achievements, Certifications |
Companies Covered | Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Deca Technologies, Jiangsu Changjiang Electronics Technology Co., Ltd, KLA Corporation, Others |
Report Price and Purchase Option | Explore our purchase options that are best suited to your resources and industry needs. |
Delivery Format | Delivered as an attached PDF and Excel through email, with an option of receiving an editable PPT, according to the purchase option. |
*At Expert Market Research, we strive to always give you current and accurate information. The numbers depicted in the description are indicative and may differ from the actual numbers in the final EMR report.
1 Preface
2 Report Coverage – Key Segmentation and Scope
3 Report Description
3.1 Market Definition and Outlook
3.2 Properties and Applications
3.3 Market Analysis
3.4 Key Players
4 Key Assumptions
5 Executive Summary
5.1 Overview
5.2 Key Drivers
5.3 Key Developments
5.4 Competitive Structure
5.5 Key Industrial Trends
6 Snapshot
6.1 Global
6.2 Regional
7 Opportunities and Challenges in the Market
8 Global Compound Semiconductor Packaging Market Analysis
8.1 Key Industry Highlights
8.2 Global Compound Semiconductor Packaging Historical Market (2018-2022)
8.3 Global Compound Semiconductor Packaging Market Forecast (2023-2028)
8.4 Global Compound Semiconductor Packaging Market by Packaging Platform
8.4.1 Flip Chip
8.4.1.1 Historical Trend (2018-2022)
8.4.1.2 Forecast Trend (2023-2028)
8.4.2 Embedded Die
8.4.2.1 Historical Trend (2018-2022)
8.4.2.2 Forecast Trend (2023-2028)
8.4.3 Fan-in WLP
8.4.3.1 Historical Trend (2018-2022)
8.4.3.2 Forecast Trend (2023-2028)
8.4.4 Fan-out WLP
8.4.4.1 Historical Trend (2018-2022)
8.4.4.2 Forecast Trend (2023-2028)
8.5 Global Compound Semiconductor Packaging Market by Application
8.5.1 CS Power Electronics
8.5.1.1 Historical Trend (2018-2022)
8.5.1.2 Forecast Trend (2023-2028)
8.5.2 CS RF/Microwave
8.5.2.1 Historical Trend (2018-2022)
8.5.2.2 Forecast Trend (2023-2028)
8.5.3 CS Photonics
8.5.3.1 Historical Trend (2018-2022)
8.5.3.2 Forecast Trend (2023-2028)
8.5.4 .CS Sensing
8.5.4.1 Historical Trend (2018-2022)
8.5.4.2 Forecast Trend (2023-2028)
8.5.5 CS Quantum
8.5.5.1 Historical Trend (2018-2022)
8.5.5.2 Forecast Trend (2023-2028)
8.6 Global Compound Semiconductor Packaging Market by End Use
8.6.1 Digital Economy
8.6.1.1 Historical Trend (2018-2022)
8.6.1.2 Forecast Trend (2023-2028)
8.6.2 Industrial and Energy & Power
8.6.2.1 Historical Trend (2018-2022)
8.6.2.2 Forecast Trend (2023-2028)
8.6.3 Defence/Security
8.6.3.1 Historical Trend (2018-2022)
8.6.3.2 Forecast Trend (2023-2028)
8.6.4 Transport
8.6.4.1 Historical Trend (2018-2022)
8.6.4.2 Forecast Trend (2023-2028)
8.6.5 Consumer Electronics
8.6.5.1 Historical Trend (2018-2022)
8.6.5.2 Forecast Trend (2023-2028)
8.6.6 Healthcare
8.6.6.1 Historical Trend (2018-2022)
8.6.6.2 Forecast Trend (2023-2028)
8.6.7 Space
8.6.7.1 Historical Trend (2018-2022)
8.6.7.2 Forecast Trend (2023-2028)
8.7 Global Compound Semiconductor Packaging Market by Region
8.7.1 North America
8.7.1.1 Historical Trend (2018-2022)
8.7.1.2 Forecast Trend (2023-2028)
8.7.2 Europe
8.7.2.1 Historical Trend (2018-2022)
8.7.2.2 Forecast Trend (2023-2028)
8.7.3 Asia Pacific
8.7.3.1 Historical Trend (2018-2022)
8.7.3.2 Forecast Trend (2023-2028)
8.7.4 Latin America
8.7.4.1 Historical Trend (2018-2022)
8.7.4.2 Forecast Trend (2023-2028)
8.7.5 Middle East and Africa
8.7.5.1 Historical Trend (2018-2022)
8.7.5.2 Forecast Trend (2023-2028)
9 North America Compound Semiconductor Packaging Market Analysis
9.1 United States of America
9.1.1 Historical Trend (2018-2022)
9.1.2 Forecast Trend (2023-2028)
9.2 Canada
9.2.1 Historical Trend (2018-2022)
9.2.2 Forecast Trend (2023-2028)
10 Europe Compound Semiconductor Packaging Market Analysis
10.1 United Kingdom
10.1.1 Historical Trend (2018-2022)
10.1.2 Forecast Trend (2023-2028)
10.2 Germany
10.2.1 Historical Trend (2018-2022)
10.2.2 Forecast Trend (2023-2028)
10.3 France
10.3.1 Historical Trend (2018-2022)
10.3.2 Forecast Trend (2023-2028)
10.4 Italy
10.4.1 Historical Trend (2018-2022)
10.4.2 Forecast Trend (2023-2028)
10.5 Others
11 Asia Pacific Compound Semiconductor Packaging Market Analysis
11.1 China
11.1.1 Historical Trend (2018-2022)
11.1.2 Forecast Trend (2023-2028)
11.2 Japan
11.2.1 Historical Trend (2018-2022)
11.2.2 Forecast Trend (2023-2028)
11.3 India
11.3.1 Historical Trend (2018-2022)
11.3.2 Forecast Trend (2023-2028)
11.4 ASEAN
11.4.1 Historical Trend (2018-2022)
11.4.2 Forecast Trend (2023-2028)
11.5 Australia
11.5.1 Historical Trend (2018-2022)
11.5.2 Forecast Trend (2023-2028)
11.6 Others
12 Latin America Compound Semiconductor Packaging Market Analysis
12.1 Brazil
12.1.1 Historical Trend (2018-2022)
12.1.2 Forecast Trend (2023-2028)
12.2 Argentina
12.2.1 Historical Trend (2018-2022)
12.2.2 Forecast Trend (2023-2028)
12.3 Mexico
12.3.1 Historical Trend (2018-2022)
12.3.2 Forecast Trend (2023-2028)
12.4 Others
13 Middle East and Africa Compound Semiconductor Packaging Market Analysis
13.1 Saudi Arabia
13.1.1 Historical Trend (2018-2022)
13.1.2 Forecast Trend (2023-2028)
13.2 United Arab Emirates
13.2.1 Historical Trend (2018-2022)
13.2.2 Forecast Trend (2023-2028)
13.3 Nigeria
13.3.1 Historical Trend (2018-2022)
13.3.2 Forecast Trend (2023-2028)
13.4 South Africa
13.4.1 Historical Trend (2018-2022)
13.4.2 Forecast Trend (2023-2028)
13.5 Others
14 Market Dynamics
14.1 SWOT Analysis
14.1.1 Strengths
14.1.2 Weaknesses
14.1.3 Opportunities
14.1.4 Threats
14.2 Porter’s Five Forces Analysis
14.2.1 Supplier’s Power
14.2.2 Buyer’s Power
14.2.3 Threat of New Entrants
14.2.4 Degree of Rivalry
14.2.5 Threat of Substitutes
14.3 Key Indicators for Demand
14.4 Key Indicators for Price
15 Value Chain Analysis
16 Competitive Landscape
16.1 Market Structure
16.2 Company Profiles
16.2.1 Advanced Semiconductor Engineering, Inc.
16.2.1.1 Company Overview
16.2.1.2 Product Portfolio
16.2.1.3 Demographic Reach and Achievements
16.2.1.4 Certifications
16.2.2 Amkor Technology, Inc.
16.2.2.1 Company Overview
16.2.2.2 Product Portfolio
16.2.2.3 Demographic Reach and Achievements
16.2.2.4 Certifications
16.2.3 Deca Technologies
16.2.3.1 Company Overview
16.2.3.2 Product Portfolio
16.2.3.3 Demographic Reach and Achievements
16.2.3.4 Certifications
16.2.4 Jiangsu Changjiang Electronics Technology Co., Ltd
16.2.4.1 Company Overview
16.2.4.2 Product Portfolio
16.2.4.3 Demographic Reach and Achievements
16.2.4.4 Certifications
16.2.5 KLA Corporation
16.2.5.1 Company Overview
16.2.5.2 Product Portfolio
16.2.5.3 Demographic Reach and Achievements
16.2.5.4 Certifications
16.2.6 Others
17 Key Trends and Developments in the Market
List of Key Figures and Tables
1. Global Compound Semiconductor Packaging Market: Key Industry Highlights, 2018 and 2028
2. Global Compound Semiconductor Packaging Historical Market: Breakup by Packaging Platform (USD Billion), 2018-2022
3. Global Compound Semiconductor Packaging Market Forecast: Breakup by Packaging Platform (USD Billion), 2023-2028
4. Global Compound Semiconductor Packaging Historical Market: Breakup by Application (USD Billion), 2018-2022
5. Global Compound Semiconductor Packaging Market Forecast: Breakup by Application (USD Billion), 2023-2028
6. Global Compound Semiconductor Packaging Historical Market: Breakup by End Use (USD Billion), 2018-2022
7. Global Compound Semiconductor Packaging Market Forecast: Breakup by End Use (USD Billion), 2023-2028
8. Global Compound Semiconductor Packaging Historical Market: Breakup by Region (USD Billion), 2018-2022
9. Global Compound Semiconductor Packaging Market Forecast: Breakup by Region (USD Billion), 2023-2028
10. North America Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2018-2022
11. North America Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2023-2028
12. Europe Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2018-2022
13. Europe Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2023-2028
14. Asia Pacific Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2018-2022
15. Asia Pacific Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2023-2028
16. Latin America Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2018-2022
17. Latin America Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2023-2028
18. Middle East and Africa Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2018-2022
19. Middle East and Africa Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2023-2028
20. Global Compound Semiconductor Packaging Market Structure
In 2022, the global compound semiconductor packaging market attained a value of nearly USD 15.86 billion.
The market is projected to grow at a CAGR of 11.3% between 2023 and 2028.
The market is estimated to witness a healthy growth in the forecast period of 2023-2028 to reach about USD 30.23 billion by 2028.
The market is being aided by technological advancements, the advent of the 5G technology, and the rising popularity of smart homes and smart buildings.
The industry is expected to be driven by the rapid electrification of automobiles, the rising research and development (R&D) activities, and the advancements in packaging technology.
The major regions in the industry are North America, Latin America, the Middle East and Africa, Europe, and the Asia Pacific.
The major packaging platforms of compound semiconductor packaging in the industry are flip chip, embedded die, fan-in WLP, and fan-out WLP.
The various applications of compound semiconductor packaging are CS power electronics, CS RF/microwave, CS photonics, CS sensing, and CS quantum.
The significant end uses in the market are digital economy, industrial and energy & power, defence/security, transport, consumer electronics, healthcare, and space.
The major players in the industry are Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Deca Technologies, Jiangsu Changjiang Electronics Technology Co., Ltd, and KLA Corporation, among others.
The global compound semiconductor packaging market attained a value of nearly USD 15.86 billion in 2022, driven by the rising popularity of smart homes and smart buildings. Aided by the rapid electrification of the automotive industry, the market is expected to witness a further growth in the forecast period of 2023-2028, growing at a CAGR of 11.3%. The market is projected to reach about USD 30.23 billion by 2028.
EMR’s meticulous research methodology delves deep into the market, covering the macro and micro aspects of the industry. Based on its packaging platforms, the compound semiconductor packaging industry can be segmented into flip chip, embedded die, fan-in WLP, and fan-out WLP. On the basis of applications, the industry is divided into CS power electronics, CS RF/microwave, CS photonics, CS sensing, and CS quantum. By end uses, the market is categorised into digital economy, industrial and energy & power, defence/security, transport, consumer electronics, healthcare, and space. The major regional markets for compound semiconductor packaging are North America, Europe, the Asia Pacific, Latin America, and the Middle East and Africa. The key players in the above market include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Deca Technologies, Jiangsu Changjiang Electronics Technology Co., Ltd, and KLA Corporation, among others.
EMR’s research methodology uses a combination of cutting-edge analytical tools and the expertise of their highly accomplished team, thus, providing their customers with market insights that are accurate, actionable, and help them remain ahead of their competition.
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