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Global Compound Semiconductor Packaging Market: By Packaging Platform: Flip Chip, Embedded Die, Fan-in WLP, Fan-out WLP; By Application: CS Power Electronics, CS RF/Microwave, Others; By End Use; Regional Analysis; Historical Market and Forecast (2016-2026); Market Dynamics; Competitive Landscape; Industry Events and Developments

Global Compound Semiconductor Packaging Market Outlook

The global compound semiconductor packaging market attained a value of about USD 12.8 billion in 2020. The market is further expected to grow in the forecast period of 2021-2026 at a CAGR of 11.3% to reach nearly USD 24.4 billion by 2026.

 

Technological Advancements Aiding the Market Growth of Compound Semiconductor Packaging

The advent of the 5G technology and surging internet penetration are increasing the use of compound semiconductors, such as gallium nitride (GaN) and silicon carbide (SiC). Moreover, the use of compound semiconductors as a substitute for silicon-based materials due to global shortage of semiconductors is propelling the industry growth. Compound semiconductors provide high temperature, high-pressure resistance, and high efficiency, due to which they are increasingly used in various electronic components. This, in turn, is increasing the applications of compound semiconductor packaging, which is invigorating the industry growth.

 

Global Compound Semiconductor Packaging Market

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The rising integration of the Internet of things (IoT) in various applications is fuelling the growth of the compound semiconductor packaging industry. The advent of smart homes and smart buildings is surging the integration of compound semiconductors to increase operational efficiency and functionality of numerous components, consequently boosting the industry growth. In addition, they enhance the efficiency of sensors to collect operational data and enable automation, due to which they are increasingly deployed in smart homes and buildings. They also protect the infrastructure from cyberattacks by providing embedded security solutions, hence providing impetus to the growth of the compound semiconductor packaging industry.

 

Compound Semiconductor Packaging: Industry Definition and Segmentation

A compound semiconductor packaging is the packaging of compound semiconductors to connect them to electronic components while protecting them from the external environment. The packaging material used is typically made up of glass, plastic, metal, or ceramic to provide corrosion and moisture resistance to compound semiconductors.

The major packaging platforms of compound semiconductor packaging are:

  • Flip Chip
  • Embedded Die
  • Fan-in WLP
  • Fan-out WLP

The market can be broadly categorised on the basis of its applications into:

  • CS Power Electronics
  • CS RF/Microwave
  • CS Photonics
  • CS Sensing
  • CS Quantum

Based on end uses, the market is divided into:

  • Digital Economy
  • Industrial and Energy & Power
  • Defence/Security
  • Transport
  • Consumer Electronics
  • Healthcare
  • Space

The EMR report looks into the regional markets of compound semiconductor packaging like North America, Europe, the Asia Pacific, the Middle East and Africa, and Latin America.

 

Rapid Electrification of the Automotive Sector to Bolster the Compound Semiconductor Packaging Industry

The technological evolution and electrification of automobiles are increasing the use of compound semiconductor packaging, therefore aiding the market growth. Compound semiconductor packaging is integral to ensure the functionality and reliability of electric components. The trend of advanced packaging to meet demands for high-quality, safety, and comfortability is expected to propel the growth of the compound semiconductor packaging industry. The extensive use of compound semiconductors in electronic components of automobiles is projected to fuel the market growth. The rapid electrification of the automotive sector and the rising popularity of electric vehicles are escalating the deployment of compound semiconductor packaging in electronic power steering, digital radio tunes, and vehicle-to-vehicle communications. Such extensive uses of compound semiconductor packaging are anticipated to accelerate the industry growth.

The evolution of packaging technology which is enhancing functionality, versatility, and applications of compound semiconductor packaging while improving the performance and cost-effectiveness of electric systems, is propelling the market growth. Increasing research and development (R&D) activities to develop cost-effective and automated compound packaging platforms to enable effective packaging for compound semiconductors such as indium phosphide (InP) is projected to augment the market growth. As applications of compound semiconductors are becoming more complex, their packaging is witnessing an advancement. This is estimated to surge the deployment of compound semiconductor packaging, therefore invigorating the industry growth.

 

Key Industry Players in the Global Compound Semiconductor Packaging Market

The report presents a detailed analysis of the following key players in the global compound semiconductor packaging market, looking into their capacity, market shares, and latest developments like capacity expansions, plant turnarounds, and mergers and acquisitions:

  • Advanced Semiconductor Engineering, Inc.
  • Amkor Technology, Inc.
  • Deca Technologies 
  • Jiangsu Changjiang Electronics Technology Co., Ltd
  • KLA Corporation
  • Others

The comprehensive report looks into the macro and micro aspects of the industry. The EMR report gives an in-depth insight into the market by providing a SWOT analysis as well as an analysis of Porter’s Five Forces model.

 

REPORT FEATURES DETAILS
Base Year 2020
Historical Period 2016-2020
Forecast Period 2021-2026
Scope of the Report Historical and Forecast Trends, Industry Drivers and Constraints, Historical and Forecast Market Analysis by Segment- Packaging Platform, Application, End Use, Region
Breakup by Packaging Platform Flip Chip, Embedded Die, Fan-in WLP, Fan-out WLP
Breakup by Application CS Power Electronics, CS RF/Microwave, CS Photonics, CS Sensing, CS Quantum
Breakup by End Use Digital Economy, Industrial and Energy & Power, Defence/Security, Transport, Consumer Electronics, Healthcare, Space
Breakup by Region North America, Europe, Asia Pacific, Latin America, Middle East and Africa
Market Dynamics SWOT, Porter's Five Forces, EMR’s Key Indicators for Price and Demand
Competitive Landscape Market Structure, Company Profiles- Company Overview, Product Portfolio, Demographic Reach and Achievements, Certifications
Companies Covered Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Deca Technologies, Jiangsu Changjiang Electronics Technology Co., Ltd, KLA Corporation, Others
Report Price and Purchase Option Explore our purchase options that are best suited to your resources and industry needs.
Delivery Format Delivered as an attached PDF and Excel through email, with an option of receiving an editable PPT, according to the purchase option.

 

*We at Expert Market Research always thrive to give you the latest information. The numbers in the article are only indicative and may be different from the actual report.

1    Preface 
2    Report Coverage – Key Segmentation and Scope
3    Report Description

    3.1    Market Definition and Outlook
    3.2    Properties and Applications
    3.3    Market Analysis
    3.4    Key Players
4    Key Assumptions
5    Executive Summary

    5.1    Overview
    5.2    Key Drivers
    5.3    Key Developments
    5.4    Competitive Structure
    5.5    Key Industrial Trends
6    Snapshot
    6.1    Global
    6.2    Regional
7    Industry Opportunities and Challenges
8    Global Compound Semiconductor Packaging Market Analysis

    8.1    Key Industry Highlights
    8.2    Global Compound Semiconductor Packaging Historical Market (2016-2020) 
    8.3    Global Compound Semiconductor Packaging Market Forecast (2021-2026)
    8.4    Global Compound Semiconductor Packaging Market by Packaging Platform
        8.4.1    Flip Chip
            8.4.1.1    Market Share
            8.4.1.2    Historical Trend (2016-2020)
            8.4.1.3    Forecast Trend (2021-2026)
        8.4.2    Embedded Die
            8.4.2.1    Market Share
            8.4.2.2    Historical Trend (2016-2020)
            8.4.2.3    Forecast Trend (2021-2026)
        8.4.3    Fan-in WLP
            8.4.3.1    Market Share
            8.4.3.2    Historical Trend (2016-2020)
            8.4.3.3    Forecast Trend (2021-2026)
        8.4.4    Fan-out WLP
            8.4.4.1    Market Share
            8.4.4.2    Historical Trend (2016-2020)
            8.4.4.3    Forecast Trend (2021-2026)
    8.5    Global Compound Semiconductor Packaging Market by Application
        8.5.1    CS Power Electronics
            8.5.1.1    Market Share
            8.5.1.2    Historical Trend (2016-2020)
            8.5.1.3    Forecast Trend (2021-2026)
        8.5.2    CS RF/Microwave
            8.5.2.1    Market Share
            8.5.2.2    Historical Trend (2016-2020)
            8.5.2.3    Forecast Trend (2021-2026)
        8.5.3    CS Photonics
            8.5.3.1    Market Share
            8.5.3.2    Historical Trend (2016-2020)
            8.5.3.3    Forecast Trend (2021-2026)
        8.5.4    .CS Sensing
            8.5.4.1    Market Share
            8.5.4.2    Historical Trend (2016-2020)
            8.5.4.3    Forecast Trend (2021-2026)
        8.5.5    CS Quantum
            8.5.5.1    Market Share
            8.5.5.2    Historical Trend (2016-2020)
            8.5.5.3    Forecast Trend (2021-2026)
    8.6    Global Compound Semiconductor Packaging Market by End Use
        8.6.1    Digital Economy
            8.6.1.1    Market Share
            8.6.1.2    Historical Trend (2016-2020)
            8.6.1.3    Forecast Trend (2021-2026)
        8.6.2    Industrial and Energy & Power
            8.6.2.1    Market Share
            8.6.2.2    Historical Trend (2016-2020)
            8.6.2.3    Forecast Trend (2021-2026)
        8.6.3    Defence/Security
            8.6.3.1    Market Share
            8.6.3.2    Historical Trend (2016-2020)
            8.6.3.3    Forecast Trend (2021-2026)
        8.6.4    Transport
            8.6.4.1    Market Share
            8.6.4.2    Historical Trend (2016-2020)
            8.6.4.3    Forecast Trend (2021-2026)
        8.6.5    Consumer Electronics
            8.6.5.1    Market Share
            8.6.5.2    Historical Trend (2016-2020)
            8.6.5.3    Forecast Trend (2021-2026)
        8.6.6    Healthcare
            8.6.6.1    Market Share
            8.6.6.2    Historical Trend (2016-2020)
            8.6.6.3    Forecast Trend (2021-2026)
        8.6.7    Space
            8.6.7.1    Market Share
            8.6.7.2    Historical Trend (2016-2020)
            8.6.7.3    Forecast Trend (2021-2026)
    8.7    Global Compound Semiconductor Packaging Market by Region
        8.7.1    Market Share
            8.7.1.1    North America
            8.7.1.2    Europe
            8.7.1.3    Asia Pacific
            8.7.1.4    Latin America
            8.7.1.5    Middle East and Africa
9    Regional Analysis
    9.1    North America
        9.1.1    Historical Trend (2016-2020)
        9.1.2    Forecast Trend (2021-2026)
        9.1.3    Breakup by Country
            9.1.3.1    United States of America 
            9.1.3.2    Canada
    9.2    Europe
        9.2.1    Historical Trend (2016-2020)
        9.2.2    Forecast Trend (2021-2026)
        9.2.3    Breakup by Country 
            9.2.3.1    United Kingdom
            9.2.3.2    Germany
            9.2.3.3    France
            9.2.3.4    Italy
            9.2.3.5    Spain
            9.2.3.6    Others
    9.3    Asia Pacific
        9.3.1    Historical Trend (2016-2020)
        9.3.2    Forecast Trend (2021-2026)
        9.3.3    Breakup by Country
            9.3.3.1    China
            9.3.3.2    Japan
            9.3.3.3    India
            9.3.3.4    ASEAN
            9.3.3.5    Australia
            9.3.3.6    Others
    9.4    Latin America
        9.4.1    Historical Trend (2016-2020)
        9.4.2    Forecast Trend (2021-2026)
        9.4.3    Breakup by Country
            9.4.3.1    Brazil
            9.4.3.2    Argentina
            9.4.3.3    Mexico
            9.4.3.4    Others
    9.5    Middle East and Africa
        9.5.1    Historical Trend (2016-2020)
        9.5.2    Forecast Trend (2021-2026)
        9.5.3    Breakup by Country
            9.5.3.1    Saudi Arabia
            9.5.3.2    United Arab Emirates
            9.5.3.3    Nigeria
            9.5.3.4    South Africa
            9.5.3.5    Others
10    Market Dynamics
    10.1    SWOT Analysis
        10.1.1    Strengths
        10.1.2    Weaknesses
        10.1.3    Opportunities
        10.1.4    Threats
    10.2    Porter’s Five Forces Analysis
        10.2.1    Supplier’s Power
        10.2.2    Buyer’s Power
        10.2.3    Threat of New Entrants
        10.2.4    Degree of Rivalry
        10.2.5    Threat of Substitutes
    10.3    EMR’s Key Indicators for Demand
    10.4    EMR’s Key Indicators for Price
11    Value Chain Analysis
12    Competitive Landscape

    12.1    Market Structure
    12.2    Company Profiles
        12.2.1    Advanced Semiconductor Engineering, Inc.
            12.2.1.1    Company Overview
            12.2.1.2    Product Portfolio
            12.2.1.3    Demographic Reach and Achievements
            12.2.1.4    Certifications
        12.2.2    Amkor Technology, Inc.
            12.2.2.1    Company Overview
            12.2.2.2    Product Portfolio
            12.2.2.3    Demographic Reach and Achievements
            12.2.2.4    Certifications
        12.2.3    Deca Technologies 
            12.2.3.1    Company Overview
            12.2.3.2    Product Portfolio
            12.2.3.3    Demographic Reach and Achievements
            12.2.3.4    Certifications
        12.2.4    Jiangsu Changjiang Electronics Technology Co., Ltd
            12.2.4.1    Company Overview
            12.2.4.2    Product Portfolio
            12.2.4.3    Demographic Reach and Achievements
            12.2.4.4    Certifications
        12.2.5    KLA Corporation
            12.2.5.1    Company Overview
            12.2.5.2    Product Portfolio
            12.2.5.3    Demographic Reach and Achievements
            12.2.5.4    Certifications
        12.2.6    Others
13    Industry Events and Developments

 

List of Figures and Tables

1.    Global Compound Semiconductor Packaging Market: Key Industry Highlights, 2016 and 2026
2.    Global Compound Semiconductor Packaging Historical Market: Breakup by Packaging Platform (USD Billion), 2016-2020
3.    Global Compound Semiconductor Packaging Market Forecast: Breakup by Packaging Platform (USD Billion), 2021-2026
4.    Global Compound Semiconductor Packaging Historical Market: Breakup by Application (USD Billion), 2016-2020
5.    Global Compound Semiconductor Packaging Market Forecast: Breakup by Application (USD Billion), 2021-2026
6.    Global Compound Semiconductor Packaging Historical Market: Breakup by End Use (USD Billion), 2016-2020
7.    Global Compound Semiconductor Packaging Market Forecast: Breakup by End Use (USD Billion), 2021-2026
8.    Global Compound Semiconductor Packaging Historical Market: Breakup by Region (USD Billion), 2016-2020
9.    Global Compound Semiconductor Packaging Market Forecast: Breakup by Region (USD Billion), 2021-2026
10.    North America Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2016-2020
11.    North America Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2021-2026
12.    Europe Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2016-2020
13.    Europe Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2021-2026
14.    Asia Pacific Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2016-2020
15.    Asia Pacific Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2021-2026
16.    Latin America Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2016-2020
17.    Latin America Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2021-2026
18.    Middle East and Africa Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2016-2020
19.    Middle East and Africa Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2021-2026
20.    Global Compound Semiconductor Packaging Market Structure

Key Questions Answered in the Report

In 2020, the global compound semiconductor packaging market attained a value of nearly USD 12.8 billion.

The market is projected to grow at a CAGR of 11.3% between 2021 and 2026.

The market is estimated to witness a healthy growth in the forecast period of 2021-2026 to reach about USD 24.4 billion by 2026.

The market is being aided by technological advancements, the advent of the 5G technology, and the rising popularity of smart homes and smart buildings.

The industry is expected to be driven by the rapid electrification of automobiles, the rising research and development (R&D) activities, and the advancements in packaging technology.

The major regions in the industry are North America, Latin America, the Middle East and Africa, Europe, and the Asia Pacific.

The major packaging platforms of compound semiconductor packaging in the industry are flip chip, embedded die, fan-in WLP, and fan-out WLP.

The various applications of compound semiconductor packaging are CS power electronics, CS RF/microwave, CS photonics, CS sensing, and CS quantum.

The significant end uses in the market are digital economy, industrial and energy & power, defence/security, transport, consumer electronics, healthcare, and space.

The major players in the industry are Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Deca Technologies, Jiangsu Changjiang Electronics Technology Co., Ltd, and KLA Corporation, among others.

Analyst Review

The global compound semiconductor packaging market attained a value of nearly USD 12.8 billion in 2020, driven by the rising popularity of smart homes and smart buildings. Aided by the rapid electrification of the automotive industry, the market is expected to witness a further growth in the forecast period of 2021-2026, growing at a CAGR of 11.3%. The market is projected to reach about USD 24.4 billion by 2026.

EMR’s meticulous research methodology delves deep into the market, covering the macro and micro aspects of the industry. Based on its packaging platforms, the compound semiconductor packaging industry can be segmented into flip chip, embedded die, fan-in WLP, and fan-out WLP. On the basis of applications, the industry is divided into CS power electronics, CS RF/microwave, CS photonics, CS sensing, and CS quantum.  By end uses, the market is categorised into digital economy, industrial and energy & power, defence/security, transport, consumer electronics, healthcare, and space. The major regional markets for compound semiconductor packaging are North America, Europe, the Asia Pacific, Latin America, and the Middle East and Africa. The key players in the above market include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Deca Technologies, Jiangsu Changjiang Electronics Technology Co., Ltd, and KLA Corporation, among others.

EMR’s research methodology uses a combination of cutting-edge analytical tools and the expertise of their highly accomplished team, thus, providing their customers with market insights that are accurate, actionable, and help them remain ahead of their competition.

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