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Compound Semiconductor Packaging Market

Global Compound Semiconductor Packaging Market Forecast: By Packaging Platform: Flip Chip, Embedded Die, Fan-in WLP, Fan-out WLP; By Application: CS Power Electronics, CS RF/Microwave, CS Photonics, CS Sensing, CS Quantum; By End Use: Digital Economy, Others; Regional Analysis; Competitive Landscape; 2024-2032

Global Compound Semiconductor Packaging Market Outlook

The global compound semiconductor packaging market attained a value of about USD 17.65 billion in 2023. The market is further expected to grow in the forecast period of 2024-2032 at a CAGR of 11.3% to reach nearly USD 46.39 billion by 2032.

 

Global Compound Semiconductor Packaging Market

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Technological Advancements Aiding the Market Growth of Compound Semiconductor Packaging

The advent of the 5G technology and surging internet penetration are increasing the use of compound semiconductors, such as gallium nitride (GaN) and silicon carbide (SiC). Moreover, the use of compound semiconductors as a substitute for silicon-based materials due to global shortage of semiconductors is propelling the industry growth. Compound semiconductors provide high temperature, high-pressure resistance, and high efficiency, due to which they are increasingly used in various electronic components. This, in turn, is increasing the applications of compound semiconductor packaging, which is invigorating the industry growth.

The rising integration of the Internet of things (IoT) in various applications is fuelling the growth of the compound semiconductor packaging industry. The advent of smart homes and smart buildings is surging the integration of compound semiconductors to increase operational efficiency and functionality of numerous components, consequently boosting the industry growth. In addition, they enhance the efficiency of sensors to collect operational data and enable automation, due to which they are increasingly deployed in smart homes and buildings. They also protect the infrastructure from cyberattacks by providing embedded security solutions, hence providing impetus to the growth of the compound semiconductor packaging industry.

 

Compound Semiconductor Packaging: Market Segmentation

A compound semiconductor packaging is the packaging of compound semiconductors to connect them to electronic components while protecting them from the external environment. The packaging material used is typically made up of glass, plastic, metal, or ceramic to provide corrosion and moisture resistance to compound semiconductors.

 

Global Compound Semiconductor Packaging Market by Segment

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The major packaging platforms of compound semiconductor packaging are:

  • Flip Chip
  • Embedded Die
  • Fan-in WLP
  • Fan-out WLP

The market can be broadly categorised on the basis of its applications into:

  • CS Power Electronics
  • CS RF/Microwave
  • CS Photonics
  • CS Sensing
  • CS Quantum

Based on end uses, the market is divided into:

  • Digital Economy
  • Industrial and Energy & Power
  • Defence/Security
  • Transport
  • Consumer Electronics
  • Healthcare
  • Space

The EMR report looks into the regional markets of compound semiconductor packaging like North America, Europe, the Asia Pacific, the Middle East and Africa, and Latin America.

 

Global Compound Semiconductor Packaging Market by Region

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Rapid Electrification of the Automotive Sector to Bolster the Compound Semiconductor Packaging Industry

The technological evolution and electrification of automobiles are increasing the use of compound semiconductor packaging, therefore aiding the market growth. Compound semiconductor packaging is integral to ensure the functionality and reliability of electric components. The trend of advanced packaging to meet demands for high-quality, safety, and comfortability is expected to propel the growth of the compound semiconductor packaging industry. The extensive use of compound semiconductors in electronic components of automobiles is projected to fuel the market growth. The rapid electrification of the automotive sector and the rising popularity of electric vehicles are escalating the deployment of compound semiconductor packaging in electronic power steering, digital radio tunes, and vehicle-to-vehicle communications. Such extensive uses of compound semiconductor packaging are anticipated to accelerate the industry growth.

The evolution of packaging technology which is enhancing functionality, versatility, and applications of compound semiconductor packaging while improving the performance and cost-effectiveness of electric systems, is propelling the market growth. Increasing research and development (R&D) activities to develop cost-effective and automated compound packaging platforms to enable effective packaging for compound semiconductors such as indium phosphide (InP) is projected to augment the market growth. As applications of compound semiconductors are becoming more complex, their packaging is witnessing an advancement. This is estimated to surge the deployment of compound semiconductor packaging, therefore invigorating the industry growth.

 

Key Industry Players in the Global Compound Semiconductor Packaging Market

The report presents a detailed analysis of the following key players in the global compound semiconductor packaging market, looking into their capacity, market shares, and latest developments like capacity expansions, plant turnarounds, and mergers and acquisitions:

  • Advanced Semiconductor Engineering, Inc.
  • Amkor Technology, Inc.
  • Deca Technologies 
  • Jiangsu Changjiang Electronics Technology Co., Ltd
  • KLA Corporation
  • Others

The comprehensive report looks into the macro and micro aspects of the industry. The EMR report gives an in-depth insight into the market by providing a SWOT analysis as well as an analysis of Porter’s Five Forces model.

 

Key Highlights of the Report

REPORT FEATURES DETAILS
Base Year 2023
Historical Period 2018-2023
Forecast Period 2024-2032
Scope of the Report

Historical and Forecast Trends, Industry Drivers and Constraints, Historical and Forecast Market Analysis by Segment:

  • Packaging Platform
  • Application
  • End Use
  • Region
Breakup by Packaging Platform
  • Flip Chip
  • Embedded Die
  • Fan-in WLP
  • Fan-out WLP
Breakup by Application
  • CS Power Electronics
  • CS RF/Microwave
  • CS Photonics
  • CS Sensing
  • CS Quantum
Breakup by End Use
  • Digital Economy
  • Industrial and Energy & Power
  • Defence/Security
  • Transport
  • Consumer Electronics
  • Healthcare
  • Space
Breakup by Region
  • North America
    • United States of America 
    • Canada
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Others
  • Asia Pacific
    • China
    • Japan
    • India
    • ASEAN
    • Australia
    • Others
  • Latin America
    • Brazil
    • Argentina
    • Mexico
    • Others
  • Middle East and Africa
    • Saudi Arabia
    • United Arab Emirates
    • Nigeria
    • South Africa
    • Others
Market Dynamics
  • SWOT Analysis
  • Porter's Five Forces Analysis
  • Key Indicators for Demand
  • Key Indicators for Price
Competitive Landscape
  • Market Structure
  • Company Profiles
    • Company Overview
    • Product Portfolio
    • Demographic Reach and Achievements
    • Certifications
Companies Covered
  • Advanced Semiconductor Engineering, Inc.
  • Amkor Technology, Inc.
  • Deca Technologies 
  • Jiangsu Changjiang Electronics Technology Co., Ltd
  • KLA Corporation
  • Others
Report Price and Purchase Option Explore our purchase options that are best suited to your resources and industry needs.
Delivery Format Delivered as an attached PDF and Excel through email, with an option of receiving an editable PPT, according to the purchase option.

 

*While we strive to always give you current and accurate information, the numbers depicted on the website are indicative and may differ from the actual numbers in the main report. At Expert Market Research, we aim to bring you the latest insights and trends in the market. Using our analyses and forecasts, stakeholders can understand the market dynamics, navigate challenges, and capitalize on opportunities to make data-driven strategic decisions.

1    Preface 
2    Report Coverage – Key Segmentation and Scope
3    Report Description

    3.1    Market Definition and Outlook
    3.2    Properties and Applications
    3.3    Market Analysis
    3.4    Key Players
4    Key Assumptions
5    Executive Summary

    5.1    Overview
    5.2    Key Drivers
    5.3    Key Developments
    5.4    Competitive Structure
    5.5    Key Industrial Trends
6    Snapshot
    6.1    Global
    6.2    Regional
7    Opportunities and Challenges in the Market
8    Global Compound Semiconductor Packaging Market Analysis

    8.1    Key Industry Highlights
    8.2    Global Compound Semiconductor Packaging Historical Market (2018-2023) 
    8.3    Global Compound Semiconductor Packaging Market Forecast (2024-2032)
    8.4    Global Compound Semiconductor Packaging Market by Packaging Platform
        8.4.1    Flip Chip
            8.4.1.1    Historical Trend (2018-2023)
            8.4.1.2    Forecast Trend (2024-2032)
        8.4.2    Embedded Die
            8.4.2.1    Historical Trend (2018-2023)
            8.4.2.2    Forecast Trend (2024-2032)
        8.4.3    Fan-in WLP
            8.4.3.1    Historical Trend (2018-2023)
            8.4.3.2    Forecast Trend (2024-2032)
        8.4.4    Fan-out WLP
            8.4.4.1    Historical Trend (2018-2023)
            8.4.4.2    Forecast Trend (2024-2032)
    8.5    Global Compound Semiconductor Packaging Market by Application
        8.5.1    CS Power Electronics
            8.5.1.1    Historical Trend (2018-2023)
            8.5.1.2    Forecast Trend (2024-2032)
        8.5.2    CS RF/Microwave
            8.5.2.1    Historical Trend (2018-2023)
            8.5.2.2    Forecast Trend (2024-2032)
        8.5.3    CS Photonics
            8.5.3.1    Historical Trend (2018-2023)
            8.5.3.2    Forecast Trend (2024-2032)
        8.5.4    .CS Sensing
            8.5.4.1    Historical Trend (2018-2023)
            8.5.4.2    Forecast Trend (2024-2032)
        8.5.5    CS Quantum
            8.5.5.1    Historical Trend (2018-2023)
            8.5.5.2    Forecast Trend (2024-2032)
    8.6    Global Compound Semiconductor Packaging Market by End Use
        8.6.1    Digital Economy
            8.6.1.1    Historical Trend (2018-2023)
            8.6.1.2    Forecast Trend (2024-2032)
        8.6.2    Industrial and Energy & Power
            8.6.2.1    Historical Trend (2018-2023)
            8.6.2.2    Forecast Trend (2024-2032)
        8.6.3    Defence/Security
            8.6.3.1    Historical Trend (2018-2023)
            8.6.3.2    Forecast Trend (2024-2032)
        8.6.4    Transport
            8.6.4.1    Historical Trend (2018-2023)
            8.6.4.2    Forecast Trend (2024-2032)
        8.6.5    Consumer Electronics
            8.6.5.1    Historical Trend (2018-2023)
            8.6.5.2    Forecast Trend (2024-2032)
        8.6.6    Healthcare
            8.6.6.1    Historical Trend (2018-2023)
            8.6.6.2    Forecast Trend (2024-2032)
        8.6.7    Space
            8.6.7.1    Historical Trend (2018-2023)
            8.6.7.2    Forecast Trend (2024-2032)
    8.7    Global Compound Semiconductor Packaging Market by Region       
        8.7.1    North America
            8.7.1.1    Historical Trend (2018-2023) 
            8.7.1.2    Forecast Trend (2024-2032)
        8.7.2    Europe
            8.7.2.1    Historical Trend (2018-2023) 
            8.7.2.2    Forecast Trend (2024-2032)
        8.7.3    Asia Pacific
            8.7.3.1    Historical Trend (2018-2023) 
            8.7.3.2    Forecast Trend (2024-2032)
        8.7.4    Latin America
            8.7.4.1    Historical Trend (2018-2023) 
            8.7.4.2    Forecast Trend (2024-2032)
        8.7.5    Middle East and Africa
            8.7.5.1    Historical Trend (2018-2023) 
            8.7.5.2    Forecast Trend (2024-2032) 
9    North America Compound Semiconductor Packaging Market Analysis
    9.1    United States of America 
        9.1.1    Historical Trend (2018-2023) 
        9.1.2    Forecast Trend (2024-2032)
    9.2    Canada
        9.2.1    Historical Trend (2018-2023) 
        9.2.2    Forecast Trend (2024-2032)
10    Europe Compound Semiconductor Packaging Market Analysis
    10.1    United Kingdom
        10.1.1    Historical Trend (2018-2023) 
        10.1.2    Forecast Trend (2024-2032)
    10.2    Germany
        10.2.1    Historical Trend (2018-2023) 
        10.2.2    Forecast Trend (2024-2032)
    10.3    France
        10.3.1    Historical Trend (2018-2023) 
        10.3.2    Forecast Trend (2024-2032)
    10.4    Italy
        10.4.1    Historical Trend (2018-2023) 
        10.4.2    Forecast Trend (2024-2032)
    10.5    Others
11    Asia Pacific Compound Semiconductor Packaging Market Analysis
    11.1    China
        11.1.1    Historical Trend (2018-2023) 
        11.1.2    Forecast Trend (2024-2032)
    11.2    Japan
        11.2.1    Historical Trend (2018-2023) 
        11.2.2    Forecast Trend (2024-2032)
    11.3    India
        11.3.1    Historical Trend (2018-2023) 
        11.3.2    Forecast Trend (2024-2032)
    11.4    ASEAN
        11.4.1    Historical Trend (2018-2023) 
        11.4.2    Forecast Trend (2024-2032)
    11.5    Australia
        11.5.1    Historical Trend (2018-2023) 
        11.5.2    Forecast Trend (2024-2032)
    11.6    Others
12    Latin America Compound Semiconductor Packaging Market Analysis
    12.1    Brazil
        12.1.1    Historical Trend (2018-2023) 
        12.1.2    Forecast Trend (2024-2032)
    12.2    Argentina
        12.2.1    Historical Trend (2018-2023) 
        12.2.2    Forecast Trend (2024-2032)
    12.3    Mexico
        12.3.1    Historical Trend (2018-2023) 
        12.3.2    Forecast Trend (2024-2032)
    12.4    Others
13    Middle East and Africa Compound Semiconductor Packaging Market Analysis
    13.1    Saudi Arabia
        13.1.1    Historical Trend (2018-2023) 
        13.1.2    Forecast Trend (2024-2032)
    13.2    United Arab Emirates
        13.2.1    Historical Trend (2018-2023) 
        13.2.2    Forecast Trend (2024-2032)
    13.3    Nigeria
        13.3.1    Historical Trend (2018-2023) 
        13.3.2    Forecast Trend (2024-2032)
    13.4    South Africa
        13.4.1    Historical Trend (2018-2023) 
        13.4.2    Forecast Trend (2024-2032)
    13.5    Others
14    Market Dynamics
    14.1    SWOT Analysis
        14.1.1    Strengths
        14.1.2    Weaknesses
        14.1.3    Opportunities
        14.1.4    Threats
    14.2    Porter’s Five Forces Analysis
        14.2.1    Supplier’s Power
        14.2.2    Buyer’s Power
        14.2.3    Threat of New Entrants
        14.2.4    Degree of Rivalry
        14.2.5    Threat of Substitutes
    14.3    Key Indicators for Demand
    14.4    Key Indicators for Price
15    Value Chain Analysis
16    Competitive Landscape

    16.1    Market Structure
    16.2    Company Profiles
        16.2.1    Advanced Semiconductor Engineering, Inc.
            16.2.1.1    Company Overview
            16.2.1.2    Product Portfolio
            16.2.1.3    Demographic Reach and Achievements
            16.2.1.4    Certifications
        16.2.2    Amkor Technology, Inc.
            16.2.2.1    Company Overview
            16.2.2.2    Product Portfolio
            16.2.2.3    Demographic Reach and Achievements
            16.2.2.4    Certifications
        16.2.3    Deca Technologies 
            16.2.3.1    Company Overview
            16.2.3.2    Product Portfolio
            16.2.3.3    Demographic Reach and Achievements
            16.2.3.4    Certifications
        16.2.4    Jiangsu Changjiang Electronics Technology Co., Ltd
            16.2.4.1    Company Overview
            16.2.4.2    Product Portfolio
            16.2.4.3    Demographic Reach and Achievements
            16.2.4.4    Certifications
        16.2.5    KLA Corporation
            16.2.5.1    Company Overview
            16.2.5.2    Product Portfolio
            16.2.5.3    Demographic Reach and Achievements
            16.2.5.4    Certifications
        16.2.6    Others
17    Key Trends and Developments in the Market

 

List of Key Figures and Tables

1.    Global Compound Semiconductor Packaging Market: Key Industry Highlights, 2018 and 2032
2.    Global Compound Semiconductor Packaging Historical Market: Breakup by Packaging Platform (USD Billion), 2018-2023
3.    Global Compound Semiconductor Packaging Market Forecast: Breakup by Packaging Platform (USD Billion), 2024-2032
4.    Global Compound Semiconductor Packaging Historical Market: Breakup by Application (USD Billion), 2018-2023
5.    Global Compound Semiconductor Packaging Market Forecast: Breakup by Application (USD Billion), 2024-2032
6.    Global Compound Semiconductor Packaging Historical Market: Breakup by End Use (USD Billion), 2018-2023
7.    Global Compound Semiconductor Packaging Market Forecast: Breakup by End Use (USD Billion), 2024-2032
8.    Global Compound Semiconductor Packaging Historical Market: Breakup by Region (USD Billion), 2018-2023
9.    Global Compound Semiconductor Packaging Market Forecast: Breakup by Region (USD Billion), 2024-2032
10.    North America Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2018-2023
11.    North America Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2024-2032
12.    Europe Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2018-2023
13.    Europe Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2024-2032
14.    Asia Pacific Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2018-2023
15.    Asia Pacific Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2024-2032
16.    Latin America Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2018-2023
17.    Latin America Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2024-2032
18.    Middle East and Africa Compound Semiconductor Packaging Historical Market: Breakup by Country (USD Billion), 2018-2023
19.    Middle East and Africa Compound Semiconductor Packaging Market Forecast: Breakup by Country (USD Billion), 2024-2032
20.    Global Compound Semiconductor Packaging Market Structure

Key Questions Answered in the Report

In 2023, the global compound semiconductor packaging market attained a value of nearly USD 17.65 billion.

The market is projected to grow at a CAGR of 11.3% between 2024 and 2032.

The market is estimated to witness a healthy growth in the forecast period of 2024-2032 to reach about USD 46.39 billion by 2032.

The market is being driven by technological advancements, the advent of the 5G technology, and the rising popularity of smart homes and smart buildings.

The key trends of the market include the rapid electrification of automobiles, rising research and development (R&D) activities, and advancements in packaging technology.

The major regions in the market are North America, Latin America, the Middle East and Africa, Europe, and the Asia Pacific.

The leading packaging platforms of compound semiconductor packaging in the market are flip chip, embedded die, fan-in WLP, and fan-out WLP.

The various applications of compound semiconductor packaging are CS power electronics, CS RF/microwave, CS photonics, CS sensing, and CS quantum.

The significant end uses in the market are digital economy, industrial and energy & power, defence/security, transport, consumer electronics, healthcare, and space.

The key players in the global compound semiconductor packaging market are Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Deca Technologies, Jiangsu Changjiang Electronics Technology Co., Ltd, and KLA Corporation, among others.

Analyst Review

The global compound semiconductor packaging market attained a value of nearly USD 17.65 billion in 2023, driven by the rising popularity of smart homes and smart buildings. Aided by the rapid electrification of the automotive industry, the market is expected to witness a further growth in the forecast period of 2024-2032, growing at a CAGR of 11.3%. The market is projected to reach about USD 46.39 billion by 2032.

EMR’s meticulous research methodology delves deep into the market, covering the macro and micro aspects of the industry. Based on its packaging platforms, the compound semiconductor packaging industry can be segmented into flip chip, embedded die, fan-in WLP, and fan-out WLP. On the basis of applications, the industry is divided into CS power electronics, CS RF/microwave, CS photonics, CS sensing, and CS quantum.  By end uses, the market is categorised into digital economy, industrial and energy & power, defence/security, transport, consumer electronics, healthcare, and space. The major regional markets for compound semiconductor packaging are North America, Europe, the Asia Pacific, Latin America, and the Middle East and Africa. The key players in the above market include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Deca Technologies, Jiangsu Changjiang Electronics Technology Co., Ltd, and KLA Corporation, among others.

EMR’s research methodology uses a combination of cutting-edge analytical tools and the expertise of their highly accomplished team, thus, providing their customers with market insights that are accurate, actionable, and help them remain ahead of their competition.

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