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The global 3D TSV And 2.5D market size reached approximately USD 57.98 billion in 2023. The market is further projected to grow at a CAGR of 8.8% between 2024 and 2032, reaching a value of USD 123.86 billion by 2032.
3D TSV And 2.5D is enhances the functioning and performance of electronic devices by enabling the integration of semiconductor dies and chips. The 3D TSV allows direct connection between the multiple layers of the chip enabling high speed communication, while the 2.5 D utilises organic interposers that bridge the gap between the chips.
Based on packaging type, the market is divided into 2.5D interposer, 3D SoC, 3D stacked memory, and CIS with TVS, among others. On the basis of end use, the market is classified into consumer electronics, automotive, and high performance computing (HPC) and networking, among others. Based on region, the 3D TSV And 2.5D market segmentation includes North America, Europe, the Asia Pacific, Latin America, and the Middle East and Africa.
The comprehensive EMR report provides an in-depth assessment of the market based on the Porter's five forces model along with giving a SWOT analysis. The report gives a detailed analysis of the following key players in the global market, covering their competitive landscape and latest developments like mergers, acquisitions, investments, and expansion plans.
Consumer electronics are expected to account for a significant 3D TSV And 2.5D market share due to the increasing adoption of tablets and smartphones, among other handheld devices. Due to the technological advancements, the production of miniaturised devices and touch screens along with other advanced features such as pressure and fingerprint sensors have increased, boosting consumer convenience. The growing penetration of online video streaming platforms is boosting television viewership and ownership, supporting the segment growth.
The Asia Pacific is anticipated to witness significant growth over the forecast period owing to the increased adoption of smartphones in the region. The rising investments in internet of things to support smart city infrastructure and the growing requirement for miniaturised IoT devices is supporting the market expansion in the Asia Pacific. The growing requirement for enhance memory solutions is further boosting the 3D TSV And 2.5D market demand.
Samsung Electronics Co. Ltd is a multinational corporation that is headquartered in Suwon-si, South Korea. The company is known for manufacturing various industrial and consumer electronic products and equipment personal computers and semiconductors, among others.
Toshiba Corp., headquartered in Tokyo, Japan, is known for manufacturing a wide range of business and consumer products including laptops, printers and copiers, HD television, and LCD devices, among others.
ASE Group is known for providing independent semiconductor assembling and test manufacturing services and for proliferating sophisticated electronics geared towards improving efficiency and lifestyle. The company was founded in 1984 and is headquartered in Kaohsiung, Taiwan.
Other 3D TSV And 2.5D market key players include Amkor Technology, Inc., Jiangsu Changing Electronics Technology Co. Ltd, United Microelectronics Corporation, ACM Research, Inc., and Powertech Technology Inc., among others.
REPORT FEATURES | DETAILS |
Base Year | 2023 |
Historical Period | 2018-2023 |
Forecast Period | 2024-2032 |
Scope of the Report |
Historical and Forecast Trends, Industry Drivers and Constraints, Historical and Forecast Market Analysis by Segment:
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Breakup by Packaging Type |
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Breakup by End Use |
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Breakup by Region |
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Market Dynamics |
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Competitive Landscape |
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Companies Covered |
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*While we strive to always give you current and accurate information, the numbers depicted on the website are indicative and may differ from the actual numbers in the main report. At Expert Market Research, we aim to bring you the latest insights and trends in the market. Using our analyses and forecasts, stakeholders can understand the market dynamics, navigate challenges, and capitalize on opportunities to make data-driven strategic decisions.*
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The market reached a value of approximately USD 57.98 billion in 2023.
The market is projected to grow at a CAGR of 8.8% between 2024 and 2032.
The market is estimated to witness a healthy growth in the forecast period of 2024-2032 to reach USD 123.86 billion by 2032.
The major market drivers include increasing popularity of miniaturised devices and rising demand from consumer electronics sector.
The key trends fuelling the growth of the market include growing requirement for advanced memory solutions and increased adoption of machine learning and artificial intelligence based devices.
The major regions in the market are North America, Europe, the Asia Pacific, Latin America, and the Middle East and Africa.
The significant end uses of 3D TSV And 2.5D include consumer electronics, automotive, and high performance computing (HPC) and networking, among others.
The key players in the market are Samsung Electronics Co. Ltd, Toshiba Corp., ASE Group, Amkor Technology, Inc., Jiangsu Changing Electronics Technology Co. Ltd, United Microelectronics Corporation, ACM Research, Inc., and Powertech Technology Inc., among others.
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United States (Head Office)
30 North Gould Street, Sheridan, WY 82801
+1-415-325-5166
Australia
63 Fiona Drive, Tamworth, NSW
+61 448 06 17 27
India
C130 Sector 2 Noida, Uttar Pradesh 201301
+91-858-608-1494
Philippines
40th Floor, PBCom Tower, 6795 Ayala Avenue Cor V.A Rufino St. Makati City, 1226.
+63 287899028, +63 967 048 3306
United Kingdom
6 Gardner Place, Becketts Close, Feltham TW14 0BX, Greater London
+44-753-713-2163
Vietnam
193/26/4 St.no.6, Ward Binh Hung Hoa, Binh Tan District, Ho Chi Minh City
+84865399124
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