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Global 3D TSV And 2.5D Market Size, Price, Trends, Forecast: By Packaging Type: 2.5D Interposer, 3D SoC, 3D Stacked Memory, CIS with TSV, Others; By End Use: Consumer Electronics, Automotive, High Performance Computing (HPC) and Networking, Others; Regional Analysis; Market Dynamics: SWOT Analysis; Competitive Landscape; 2024-2032
Global 3D TSV And 2.5D Market Outlook
The global 3D TSV And 2.5D market size reached approximately USD 57.98 billion in 2023. The market is further projected to grow at a CAGR of 8.8% between 2024 and 2032, reaching a value of USD 123.86 billion by 2032.
Key Trends in the Market
3D TSV And 2.5D is enhances the functioning and performance of electronic devices by enabling the integration of semiconductor dies and chips. The 3D TSV allows direct connection between the multiple layers of the chip enabling high speed communication, while the 2.5 D utilises organic interposers that bridge the gap between the chips.
- The increased adoption of machine learning and artificial intelligence is a key trend aiding the 3D TSV And 2.5D market growth as they provide memory stacking abilities and aid in performance improvement of devices that are machine learning and artificial intelligence based.
- 3D TSV semiconductor packaging technology enables reduced data transmission time between chips resulting in faster speed and decreased power consumption, boosting the market growth. Due to the rising complexities of semiconductor devices the demand for 3D TSV AND 2.5D is increasing as they allow high integration levels and enhanced functionality.
- The growing requirement for advanced memory solutions is another major factor supporting the market expansion as 3D TSV AND 2.5D facilitates high memory capacity and bandwidth, resulting in their increased incorporation in various electronic devices.
Global 3D TSV And 2.5D Market Analysis
Based on packaging type, the market is divided into 2.5D interposer, 3D SoC, 3D stacked memory, and CIS with TVS, among others. On the basis of end use, the market is classified into consumer electronics, automotive, and high performance computing (HPC) and networking, among others. Based on region, the 3D TSV And 2.5D market segmentation includes North America, Europe, the Asia Pacific, Latin America, and the Middle East and Africa.
The comprehensive EMR report provides an in-depth assessment of the market based on the Porter's five forces model along with giving a SWOT analysis. The report gives a detailed analysis of the following key players in the global market, covering their competitive landscape and latest developments like mergers, acquisitions, investments, and expansion plans.
- Samsung Electronics Co. Ltd
- Toshiba Corp.
- ASE Group
- Amkor Technology, Inc.
- Jiangsu Changing Electronics Technology Co. Ltd
- United Microelectronics Corporation
- ACM Research, Inc.
- Powertech Technology Inc.
- Other
Market Share by End Use
Consumer electronics are expected to account for a significant 3D TSV And 2.5D market share due to the increasing adoption of tablets and smartphones, among other handheld devices. Due to the technological advancements, the production of miniaturised devices and touch screens along with other advanced features such as pressure and fingerprint sensors have increased, boosting consumer convenience. The growing penetration of online video streaming platforms is boosting television viewership and ownership, supporting the segment growth.
Market Share by Region
The Asia Pacific is anticipated to witness significant growth over the forecast period owing to the increased adoption of smartphones in the region. The rising investments in internet of things to support smart city infrastructure and the growing requirement for miniaturised IoT devices is supporting the market expansion in the Asia Pacific. The growing requirement for enhance memory solutions is further boosting the 3D TSV And 2.5D market demand.
Competitive Landscape
Samsung Electronics Co. Ltd is a multinational corporation that is headquartered in Suwon-si, South Korea. The company is known for manufacturing various industrial and consumer electronic products and equipment personal computers and semiconductors, among others.
Toshiba Corp., headquartered in Tokyo, Japan, is known for manufacturing a wide range of business and consumer products including laptops, printers and copiers, HD television, and LCD devices, among others.
ASE Group is known for providing independent semiconductor assembling and test manufacturing services and for proliferating sophisticated electronics geared towards improving efficiency and lifestyle. The company was founded in 1984 and is headquartered in Kaohsiung, Taiwan.
Other 3D TSV And 2.5D market key players include Amkor Technology, Inc., Jiangsu Changing Electronics Technology Co. Ltd, United Microelectronics Corporation, ACM Research, Inc., and Powertech Technology Inc., among others.
Key Highlights of the Report
| REPORT FEATURES | DETAILS |
| Base Year | 2023 |
| Historical Period | 2018-2023 |
| Forecast Period | 2024-2032 |
| Scope of the Report |
Historical and Forecast Trends, Industry Drivers and Constraints, Historical and Forecast Market Analysis by Segment:
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| Breakup by Packaging Type |
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| Breakup by End Use |
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| Breakup by Region |
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| Market Dynamics |
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| Competitive Landscape |
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| Companies Covered |
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*At Expert Market Research, we strive to always give you current and accurate information. The numbers depicted in the description are indicative and may differ from the actual numbers in the final EMR report.
1 Preface
2 Report Coverage – Key Segmentation and Scope
3 Report Description
3.1 Market Definition and Outlook
3.2 Properties and Applications
3.3 Market Analysis
3.4 Key Players
4 Key Assumptions
5 Executive Summary
5.1 Overview
5.2 Key Drivers
5.3 Key Developments
5.4 Competitive Structure
5.5 Key Industrial Trends
6 Market Snapshot
6.1 Global
6.2 Regional
7 Opportunities and Challenges in the Market
8 Global 3D TSV And 2.5D Market Analysis
8.1 Key Industry Highlights
8.2 Global 3D TSV And 2.5D Historical Market (2018-2023)
8.3 Global 3D TSV And 2.5D Market Forecast (2024-2032)
8.4 Global 3D TSV And 2.5D Market by Packaging Type
8.4.1 2.5D Interposer
8.4.1.1 Historical Trend (2018-2023)
8.4.1.2 Forecast Trend (2024-2032)
8.4.2 3D SoC
8.4.2.1 Historical Trend (2018-2023)
8.4.2.2 Forecast Trend (2024-2032)
8.4.3 3D Stacked Memory
8.4.3.1 Historical Trend (2018-2023)
8.4.3.2 Forecast Trend (2024-2032)
8.4.4 CIS with TSV
8.4.4.1 Historical Trend (2018-2023)
8.4.4.2 Forecast Trend (2024-2032)
8.4.5 Others
8.5 Global 3D TSV And 2.5D Market by End Use
8.5.1 Consumer Electronics
8.5.1.1 Historical Trend (2018-2023)
8.5.1.2 Forecast Trend (2024-2032)
8.5.2 Automotive
8.5.2.1 Historical Trend (2018-2023)
8.5.2.2 Forecast Trend (2024-2032)
8.5.3 High Performance Computing (HPC) and Networking
8.5.3.1 Historical Trend (2018-2023)
8.5.3.2 Forecast Trend (2024-2032)
8.5.4 Others
8.6 Global 3D TSV And 2.5D Market by Region
8.6.1 North America
8.6.1.1 Historical Trend (2018-2023)
8.6.1.2 Forecast Trend (2024-2032)
8.6.2 Europe
8.6.2.1 Historical Trend (2018-2023)
8.6.2.2 Forecast Trend (2024-2032)
8.6.3 Asia Pacific
8.6.3.1 Historical Trend (2018-2023)
8.6.3.2 Forecast Trend (2024-2032)
8.6.4 Latin America
8.6.4.1 Historical Trend (2018-2023)
8.6.4.2 Forecast Trend (2024-2032)
8.6.5 Middle East and Africa
8.6.5.1 Historical Trend (2018-2023)
8.6.5.2 Forecast Trend (2024-2032)
9 North America 3D TSV And 2.5D Market Analysis
9.1 United States of America
9.1.1 Historical Trend (2018-2023)
9.1.2 Forecast Trend (2024-2032)
9.2 Canada
9.2.1 Historical Trend (2018-2023)
9.2.2 Forecast Trend (2024-2032)
10 Europe 3D TSV And 2.5D Market Analysis
10.1 United Kingdom
10.1.1 Historical Trend (2018-2023)
10.1.2 Forecast Trend (2024-2032)
10.2 Germany
10.2.1 Historical Trend (2018-2023)
10.2.2 Forecast Trend (2024-2032)
10.3 France
10.3.1 Historical Trend (2018-2023)
10.3.2 Forecast Trend (2024-2032)
10.4 Italy
10.4.1 Historical Trend (2018-2023)
10.4.2 Forecast Trend (2024-2032)
10.5 Others
11 Asia Pacific 3D TSV And 2.5D Market Analysis
11.1 China
11.1.1 Historical Trend (2018-2023)
11.1.2 Forecast Trend (2024-2032)
11.2 Japan
11.2.1 Historical Trend (2018-2023)
11.2.2 Forecast Trend (2024-2032)
11.3 India
11.3.1 Historical Trend (2018-2023)
11.3.2 Forecast Trend (2024-2032)
11.4 ASEAN
11.4.1 Historical Trend (2018-2023)
11.4.2 Forecast Trend (2024-2032)
11.5 Australia
11.5.1 Historical Trend (2018-2023)
11.5.2 Forecast Trend (2024-2032)
11.6 Others
12 Latin America 3D TSV And 2.5D Market Analysis
12.1 Brazil
12.1.1 Historical Trend (2018-2023)
12.1.2 Forecast Trend (2024-2032)
12.2 Argentina
12.2.1 Historical Trend (2018-2023)
12.2.2 Forecast Trend (2024-2032)
12.3 Mexico
12.3.1 Historical Trend (2018-2023)
12.3.2 Forecast Trend (2024-2032)
12.4 Others
13 Middle East and Africa 3D TSV And 2.5D Market Analysis
13.1 Saudi Arabia
13.1.1 Historical Trend (2018-2023)
13.1.2 Forecast Trend (2024-2032)
13.2 United Arab Emirates
13.2.1 Historical Trend (2018-2023)
13.2.2 Forecast Trend (2024-2032)
13.3 Nigeria
13.3.1 Historical Trend (2018-2023)
13.3.2 Forecast Trend (2024-2032)
13.4 South Africa
13.4.1 Historical Trend (2018-2023)
13.4.2 Forecast Trend (2024-2032)
13.5 Others
14 Market Dynamics
14.1 SWOT Analysis
14.1.1 Strengths
14.1.2 Weaknesses
14.1.3 Opportunities
14.1.4 Threats
14.2 Porter’s Five Forces Analysis
14.2.1 Supplier’s Power
14.2.2 Buyer’s Power
14.2.3 Threat of New Entrants
14.2.4 Degree of Rivalry
14.2.5 Threat of Substitutes
14.3 Key Indicators for Demand
14.4 Key Indicators for Price
15 Competitive Landscape
15.1 Market Structure
15.2 Company Profiles
15.2.1 Samsung Electronics Co. Ltd
15.2.1.1 Company Overview
15.2.1.2 Product Portfolio
15.2.1.3 Demographic Reach and Achievements
15.2.1.4 Certifications
15.2.2 Toshiba Corp.
15.2.2.1 Company Overview
15.2.2.2 Product Portfolio
15.2.2.3 Demographic Reach and Achievements
15.2.2.4 Certifications
15.2.3 ASE Group
15.2.3.1 Company Overview
15.2.3.2 Product Portfolio
15.2.3.3 Demographic Reach and Achievements
15.2.3.4 Certifications
15.2.4 Amkor Technology, Inc.
15.2.4.1 Company Overview
15.2.4.2 Product Portfolio
15.2.4.3 Demographic Reach and Achievements
15.2.4.4 Certifications
15.2.5 Jiangsu Changing Electronics Technology Co. Ltd
15.2.5.1 Company Overview
15.2.5.2 Product Portfolio
15.2.5.3 Demographic Reach and Achievements
15.2.5.4 Certifications
15.2.6 United Microelectronics Corporation
15.2.6.1 Company Overview
15.2.6.2 Product Portfolio
15.2.6.3 Demographic Reach and Achievements
15.2.6.4 Certifications
15.2.7 ACM Research, Inc.
15.2.7.1 Company Overview
15.2.7.2 Product Portfolio
15.2.7.3 Demographic Reach and Achievements
15.2.7.4 Certifications
15.2.8 Powertech Technology Inc.
15.2.8.1 Company Overview
15.2.8.2 Product Portfolio
15.2.8.3 Demographic Reach and Achievements
15.2.8.4 Certifications
15.2.9 Other
16 Key Trends and Developments in the Market
List of Key Figures and Tables
1. Global 3D TSV And 2.5D Market: Key Industry Highlights, 2018 and 2032
2. Global 3D TSV And 2.5D Historical Market: Breakup by Packaging Type (USD Million), 2018-2023
3. Global 3D TSV And 2.5D Market Forecast: Breakup by Packaging Type (USD Million), 2024-2032
4. Global 3D TSV And 2.5D Historical Market: Breakup by End Use (USD Million), 2018-2023
5. Global 3D TSV And 2.5D Market Forecast: Breakup by End Use (USD Million), 2024-2032
6. Global 3D TSV And 2.5D Historical Market: Breakup by Region (USD Million), 2018-2023
7. Global 3D TSV And 2.5D Market Forecast: Breakup by Region (USD Million), 2024-2032
8. North America 3D TSV And 2.5D Historical Market: Breakup by Country (USD Million), 2018-2023
9. North America 3D TSV And 2.5D Market Forecast: Breakup by Country (USD Million), 2024-2032
10. Europe 3D TSV And 2.5D Historical Market: Breakup by Country (USD Million), 2018-2023
11. Europe 3D TSV And 2.5D Market Forecast: Breakup by Country (USD Million), 2024-2032
12. Asia Pacific 3D TSV And 2.5D Historical Market: Breakup by Country (USD Million), 2018-2023
13. Asia Pacific 3D TSV And 2.5D Market Forecast: Breakup by Country (USD Million), 2024-2032
14. Latin America 3D TSV And 2.5D Historical Market: Breakup by Country (USD Million), 2018-2023
15. Latin America 3D TSV And 2.5D Market Forecast: Breakup by Country (USD Million), 2024-2032
16. Middle East and Africa 3D TSV And 2.5D Historical Market: Breakup by Country (USD Million), 2018-2023
17. Middle East and Africa 3D TSV And 2.5D Market Forecast: Breakup by Country (USD Million), 2024-2032
18. Global 3D TSV And 2.5D Market Structure
Key Questions Answered in the Report
The market reached a value of approximately USD 57.98 billion in 2023.
The market is projected to grow at a CAGR of 8.8% between 2024 and 2032.
The market is estimated to witness a healthy growth in the forecast period of 2024-2032 to reach USD 123.86 billion by 2032.
The major market drivers include increasing popularity of miniaturised devices and rising demand from consumer electronics sector.
The key trends fuelling the growth of the market include growing requirement for advanced memory solutions and increased adoption of machine learning and artificial intelligence based devices.
The major regions in the market are North America, Europe, the Asia Pacific, Latin America, and the Middle East and Africa.
The significant end uses of 3D TSV And 2.5D include consumer electronics, automotive, and high performance computing (HPC) and networking, among others.
The key players in the market are Samsung Electronics Co. Ltd, Toshiba Corp., ASE Group, Amkor Technology, Inc., Jiangsu Changing Electronics Technology Co. Ltd, United Microelectronics Corporation, ACM Research, Inc., and Powertech Technology Inc., among others.
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