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Global Flip Chip Market Analysis, Share, Trends, Forecast: By Packaging Technology: 3D IC, 2.5D IC, 2D IC; By Bumping Technology: Copper Pillar, Solder Bumping, Gold Bumping, Others; By Industry Vertical: Electronics, Industrial, Healthcare, Automotive and Transport, Others; Regional Analysis; Competitive Landscape; 2024-2032
Global Flip Chip Market Outlook
The global flip chip market attained a value of about USD 31.37 billion in 2023. The market is further expected to grow at a CAGR of 6.1% during the forecast period of 2024-2032 to reach nearly USD 53.34 billion by 2032.
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Surging Demand for Miniature Silicon Packaging in Electronic Devices to Bolster the Market Growth of Flip Chip
The market demand for flip chip is rising due to the surging demand for miniaturisation and high performance in electronic devices. The requirement of low-cost packaging technologies is spurring the demand for silicon photonics in optical interconnections, resulting in a surging demand for scalable and tolerant optical interfacing methods based on flip chip bonding. Therefore, extensive deployment of flip chip technology in silicon packaging is augmenting the market for flip chip.
Silicon packaging is used in a number of electronic devices due to reduced cost, high-density packaging, and improved reliance properties of flip chip. Further, as the technology eliminates the need for wire-bonding, it aids in compact designs of electronic devices. Hence, the strong penetration of advanced packaging technology in electronics is positively influencing the market growth of flip chip technology.
Flip Chip: Market Segmentation
Flip chip is a chip packaging technique that refers to an electronic component or semiconductor that can be installed onto an underlying substance. The chips consist of conductive polymers, by virtue of which, electrical connection is established.
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On the basis of packaging technology, the market can be divided into:
- 3D IC
- 2.5D IC
- 2D IC
Based on bumping technology, the market can be segmented into:
- Copper Pillar
- Solder Bumping
- Gold Bumping
- Others
On the basis of industry vertical, the market can be broadly categorised into:
- Electronics
- Industrial
- Healthcare
- Automotive and Transport
- IT and Telecommunication
- Aerospace and Defence
- Others
The EMR report looks into the regional markets of flip chip like North America, Latin America, the Asia Pacific, Europe, and the Middle East and Africa.
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Emerging Copper Pillar Bumping Flip Chip Technology to Aid the Market Growth in the Forecast Period
The copper pillar bumping technology is an emerging flip chip technology that is anticipated to drive the market growth of flip chip technology. The copper pillars are deployed in package applications for portable electronic devices due to the demand for the smaller form factor, better performance, and lower power consumption and can substantially reduce costs in many applications. The copper pillar flip chip technology uses copper posts capped with solder instead of regular solder ball bump to achieve less than 150 µm pitch. Therefore, the deployment of copper pillar bumping technology in high performance, ultra-fine pitch, and high-density interconnection in devices like transceivers, microprocessors, and power management are anticipated to aid the industry growth for flip chip.
In addition, the market demand for copper pillars can be attributed to higher I/O counts, lithography nodes below 28 µm, and the emergence of 3D packaging. Further, the properties of copper pillar technology aids in improved density connections, enhanced thermal and electrical dissipation, thus, aiding the growth prospects of the flip chip technology. Therefore, the benefits associated with copper pillar bumping is projected to drive the market growth in the forecast period.
Key Industry Players in the Global Flip Chip Market
The report presents a detailed analysis of the following key players in the global flip chip market, looking into their capacity, market share, and latest developments like capacity expansions, plant turnabouts and mergers and acquisitions.
- 3M Company
- Advanced Micro Devices, Inc.
- Amkor Technology, Inc
- Apple Inc.
- Intel Corporation
- Others
The comprehensive report looks at the micro and macro aspects of the industry. The EMR report gives an in-depth insight into the market by providing a SWOT analysis as well as an analysis of the Porter’s Five Forces Model.
| REPORT FEATURES | DETAILS |
|---|---|
| Base Year | 2023 |
| Historical Period | 2018-2023 |
| Forecast Period | 2024-2032 |
| Scope of the Report | Historical and Forecast Trends, Industry Drivers and Constraints, Historical and Forecast Market Analysis by Segment- Packaging Technology, Bumping Technology, Industry Vertical, Region |
| Breakup by Packaging Technology | 3D IC, 2.5D IC, 2D IC |
| Breakup by Bumping Technology | Copper Pillar, Solder Bumping, Gold Bumping, Others |
| Breakup by Industry Vertical | Electronics, Industrial, Healthcare, Automotive and Transport, IT and Telecommunication, Aerospace and Defence, Others |
| Breakup by Region | North America, Europe, Asia Pacific, Latin America, Middle East and Africa |
| Market Dynamics | SWOT, Porter's Five Forces, Key Indicators for Price and Demand |
| Competitive Landscape | Market Structure, Company Profiles- Company Overview, Product Portfolio, Demographic Reach and Achievements, Certifications |
| Companies Covered | 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., Intel Corporation, Others |
| Report Price and Purchase Option | Explore our purchase options that are best suited to your resources and industry needs. |
| Delivery Format | Delivered as an attached PDF and Excel through email, with an option of receiving an editable PPT, according to the purchase option. |
*At Expert Market Research, we strive to always give you current and accurate information. The numbers depicted in the description are indicative and may differ from the actual numbers in the final EMR report.
1 Preface
2 Report Coverage – Key Segmentation and Scope
3 Report Description
3.1 Market Definition and Outlook
3.2 Properties and Applications
3.3 Market Analysis
3.4 Key Players
4 Key Assumptions
5 Executive Summary
5.1 Overview
5.2 Key Drivers
5.3 Key Developments
5.4 Competitive Structure
5.5 Key Industrial Trends
6 Snapshot
6.1 Global
6.2 Regional
7 Opportunities and Challenges in the Market
8 Global Flip Chip Market Analysis
8.1 Key Industry Highlights
8.2 Global Flip Chip Historical Market (2018-2023)
8.3 Global Flip Chip Market Forecast (2024-2032)
8.4 Global Flip Chip Market by Packaging Technology
8.4.1 3D IC
8.4.1.1 Historical Trend (2018-2023)
8.4.1.2 Forecast Trend (2024-2032)
8.4.2 2.5D IC
8.4.2.1 Historical Trend (2018-2023)
8.4.2.2 Forecast Trend (2024-2032)
8.4.3 2D IC
8.4.3.1 Historical Trend (2018-2023)
8.4.3.2 Forecast Trend (2024-2032)
8.5 Global Flip Chip Market by Bumping Technology
8.5.1 Copper Pillar
8.5.1.1 Historical Trend (2018-2023)
8.5.1.2 Forecast Trend (2024-2032)
8.5.2 Solder Bumping
8.5.2.1 Historical Trend (2018-2023)
8.5.2.2 Forecast Trend (2024-2032)
8.5.3 Gold Bumping
8.5.3.1 Historical Trend (2018-2023)
8.5.3.2 Forecast Trend (2024-2032)
8.5.4 Others
8.6 Global Flip Chip Market by Industry Vertical
8.6.1 Electronics
8.6.1.1 Historical Trend (2018-2023)
8.6.1.2 Forecast Trend (2024-2032)
8.6.2 Industrial
8.6.2.1 Historical Trend (2018-2023)
8.6.2.2 Forecast Trend (2024-2032)
8.6.3 Healthcare
8.6.3.1 Historical Trend (2018-2023)
8.6.3.2 Forecast Trend (2024-2032)
8.6.4 Automotive and Transport
8.6.4.1 Historical Trend (2018-2023)
8.6.4.2 Forecast Trend (2024-2032)
8.6.5 IT and Telecommunication
8.6.5.1 Historical Trend (2018-2023)
8.6.5.2 Forecast Trend (2024-2032)
8.6.6 Aerospace and Defence
8.6.6.1 Historical Trend (2018-2023)
8.6.6.2 Forecast Trend (2024-2032)
8.6.7 Others
8.7 Global Flip Chip Market by Region
8.7.1 North America
8.7.1.1 Historical Trend (2018-2023)
8.7.1.2 Forecast Trend (2024-2032)
8.7.2 Europe
8.7.2.1 Historical Trend (2018-2023)
8.7.2.2 Forecast Trend (2024-2032)
8.7.3 Asia Pacific
8.7.3.1 Historical Trend (2018-2023)
8.7.3.2 Forecast Trend (2024-2032)
8.7.4 Latin America
8.7.4.1 Historical Trend (2018-2023)
8.7.4.2 Forecast Trend (2024-2032)
8.7.5 Middle East and Africa
8.7.5.1 Historical Trend (2018-2023)
8.7.5.2 Forecast Trend (2024-2032)
9 North America Flip Chip Market Analysis
9.1 United States of America
9.1.1 Historical Trend (2018-2023)
9.1.2 Forecast Trend (2024-2032)
9.2 Canada
9.2.1 Historical Trend (2018-2023)
9.2.2 Forecast Trend (2024-2032)
10 Europe Flip Chip Market Analysis
10.1 United Kingdom
10.1.1 Historical Trend (2018-2023)
10.1.2 Forecast Trend (2024-2032)
10.2 Germany
10.2.1 Historical Trend (2018-2023)
10.2.2 Forecast Trend (2024-2032)
10.3 France
10.3.1 Historical Trend (2018-2023)
10.3.2 Forecast Trend (2024-2032)
10.4 Italy
10.4.1 Historical Trend (2018-2023)
10.4.2 Forecast Trend (2024-2032)
10.5 Others
11 Asia Pacific Flip Chip Market Analysis
11.1 China
11.1.1 Historical Trend (2018-2023)
11.1.2 Forecast Trend (2024-2032)
11.2 Japan
11.2.1 Historical Trend (2018-2023)
11.2.2 Forecast Trend (2024-2032)
11.3 India
11.3.1 Historical Trend (2018-2023)
11.3.2 Forecast Trend (2024-2032)
11.4 ASEAN
11.4.1 Historical Trend (2018-2023)
11.4.2 Forecast Trend (2024-2032)
11.5 Australia
11.5.1 Historical Trend (2018-2023)
11.5.2 Forecast Trend (2024-2032)
11.6 Others
12 Latin America Flip Chip Market Analysis
12.1 Brazil
12.1.1 Historical Trend (2018-2023)
12.1.2 Forecast Trend (2024-2032)
12.2 Argentina
12.2.1 Historical Trend (2018-2023)
12.2.2 Forecast Trend (2024-2032)
12.3 Mexico
12.3.1 Historical Trend (2018-2023)
12.3.2 Forecast Trend (2024-2032)
12.4 Others
13 Middle East and Africa Flip Chip Market Analysis
13.1 Saudi Arabia
13.1.1 Historical Trend (2018-2023)
13.1.2 Forecast Trend (2024-2032)
13.2 United Arab Emirates
13.2.1 Historical Trend (2018-2023)
13.2.2 Forecast Trend (2024-2032)
13.3 Nigeria
13.3.1 Historical Trend (2018-2023)
13.3.2 Forecast Trend (2024-2032)
13.4 South Africa
13.4.1 Historical Trend (2018-2023)
13.4.2 Forecast Trend (2024-2032)
13.5 Others
14 Market Dynamics
14.1 SWOT Analysis
14.1.1 Strengths
14.1.2 Weaknesses
14.1.3 Opportunities
14.1.4 Threats
14.2 Porter’s Five Forces Analysis
14.2.1 Supplier’s Power
14.2.2 Buyer’s Power
14.2.3 Threat of New Entrants
14.2.4 Degree of Rivalry
14.2.5 Threat of Substitutes
14.3 Key Indicators for Demand
14.4 Key Indicators for Price
15 Value Chain Analysis
16 Competitive Landscape
16.1 Market Structure
16.2 Company Profiles
16.2.1 3M Company
16.2.1.1 Company Overview
16.2.1.2 Product Portfolio
16.2.1.3 Demographic Reach and Achievements
16.2.1.4 Certifications
16.2.2 Advanced Micro Devices, Inc.
16.2.2.1 Company Overview
16.2.2.2 Product Portfolio
16.2.2.3 Demographic Reach and Achievements
16.2.2.4 Certifications
16.2.3 Amkor Technology, Inc.
16.2.3.1 Company Overview
16.2.3.2 Product Portfolio
16.2.3.3 Demographic Reach and Achievements
16.2.3.4 Certifications
16.2.4 Apple Inc.
16.2.4.1 Company Overview
16.2.4.2 Product Portfolio
16.2.4.3 Demographic Reach and Achievements
16.2.4.4 Certifications
16.2.5 Intel Corporation
16.2.5.1 Company Overview
16.2.5.2 Product Portfolio
16.2.5.3 Demographic Reach and Achievements
16.2.5.4 Certifications
16.2.6 Others
17 Key Trends and Developments in the Market
Additional Customisations Available
1 Manufacturing Process
1.1 Overview
1.2 Detailed Process Flow
1.3 Operation Involved
List of Key Figures and Tables
1. Global Flip Chip Market: Key Industry Highlights, 2018 and 2032
2. Global Flip Chip Historical Market: Breakup by Packaging Technology (USD Billion), 2018-2023
3. Global Flip Chip Market Forecast: Breakup by Packaging Technology (USD Billion), 2024-2032
4. Global Flip Chip Historical Market: Breakup by Bumping Technology (USD Billion), 2018-2023
5. Global Flip Chip Market Forecast: Breakup by Bumping Technology (USD Billion), 2024-2032
6. Global Flip Chip Historical Market: Breakup by Industry Vertical (USD Billion), 2018-2023
7. Global Flip Chip Market Forecast: Breakup by Industry Vertical (USD Billion), 2024-2032
8. Global Flip Chip Historical Market: Breakup by Region (USD Billion), 2018-2023
9. Global Flip Chip Market Forecast: Breakup by Region (USD Billion), 2024-2032
10. North America Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
11. North America Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
12. Europe Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
13. Europe Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
14. Asia Pacific Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
15. Asia Pacific Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
16. Latin America Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
17. Latin America Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
18. Middle East and Africa Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
19. Middle East and Africa Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
20. Global Flip Chip Market Structure
Key Questions Answered in the Report
The global flip chip market attained a value of nearly USD 31.37 billion in 2023.
The market is projected to grow at a CAGR of 6.1% in the forecast period of 2024-2032.
The market is estimated to witness a healthy growth in the forecast period of 2024-2032 to reach about USD 53.34 billion by 2032.
The major market drivers include the growing demand for low-cost and miniature silicon packaging in electronic devices and the rising penetration of advanced packaging solutions in electronics.
The growing utilisation of copper pillar bumping technology and increasing R&D activities by leading companies are the key trends fuelling the market growth.
The major regional markets for flip chip are North America, Latin America, the Asia Pacific, Europe, and the Middle East and Africa.
The different packaging technologies considered in the market report are 3D IC, 2.5D IC, and 2D IC.
Copper pillar, solder bumping, and gold bumping, among others, are the various bumping technologies included in the market report.
The significant industry verticals considered in the market report are electronics, industrial, healthcare, automotive and transport, IT and telecommunication, and aerospace and defence, among others.
The major players in the market are 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., and Intel Corporation, among others.
Analyst Review
The global flip chip market attained a value of about USD 31.37 billion in 2023, driven by the deployment of flip chip technology in silicon packaging. Aided by emerging copper pillar bumping technology, the market is expected to grow at a CAGR of 6.1% in the forecast period of 2024-2032 to reach nearly USD 53.34 billion by 2032.
EMR’s meticulous research methodology delves deep into the market covering the macro and micro aspects of the industry. On the basis of packaging technology, the market can be segmented into 3D IC, 2.5D IC, and 2D IC. Based on bumping technology, the market is divided into copper pillar, solder bumping, and gold bumping, among others. The market segmentations based on industry vertical are electronics, industrial, healthcare, automotive and transport, IT and telecommunication, and aerospace and defence, among others. The major regional markets for flip chip are North America, Latin America, the Asia Pacific, Europe, and the Middle East and Africa. They key players in the industry are 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., and Intel Corporation, among others.
EMR’s research methodology uses a combination of cutting-edge analytical tools and the expertise of their highly accomplished team, thus providing their customers with market insights that are accurate, actionable and help them remain ahead of their competition.
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