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Global Flip Chip Market: By Packaging Technology: 3D IC, 2.5D IC, 2D IC; By Bumping Technology: Copper Pillar, Solder Bumping, Gold Bumping, Others; By Industry Vertical: Electronics, Others; Regional Analysis; Historical Market and Forecast (2016-2026); Market Dynamics; Competitive Landscape; Industry Events and Developments

Global Flip Chip Market Outlook

The global flip chip market attained a value of about USD 26.27 billion in 2020. The market is further expected to grow at a CAGR of 6.1% during the forecast period of 2021-2026 to reach nearly USD 37.39 billion by 2026.

 

Surging Demand for Miniature Silicon Packaging in Electronic Devices to Bolster the Market Growth of Flip Chip

The market demand for flip chip is rising due to the surging demand for miniaturisation and high performance in electronic devices. The requirement of low-cost packaging technologies is spurring the demand for silicon photonics in optical interconnections, resulting in a surging demand for scalable and tolerant optical interfacing methods based on flip chip bonding.  Therefore, extensive deployment of flip chip technology in silicon packaging is augmenting the market for flip chip.

 

Global Flip Chip Market

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Silicon packaging is used in a number of electronic devices due to reduced cost, high-density packaging, and improved reliance properties of flip chip. Further, as the technology eliminates the need for wire-bonding, it aids in compact designs of electronic devices. Hence, the strong penetration of advanced packaging technology in electronics is positively influencing the market growth of flip chip technology.

 

Flip Chip: Industry Definition and Segmentation

Flip chip is a chip packaging technique that refers to an electronic component or semiconductor that can be installed onto an underlying substance. The chips consist of conductive polymers, by virtue of which, electrical connection is established.

On the basis of packaging technology, the market can be divided into:

  • 3D IC
  • 2.5D IC
  • 2D IC

Based on bumping technology, the market can be segmented into:

  • Copper Pillar
  • Solder Bumping
  • Gold Bumping
  • Others

On the basis of industry vertical, the market can be broadly categorised into:

  • Electronics
  • Industrial
  • Healthcare
  • Automotive and Transport
  • IT and Telecommunication
  • Aerospace and Defence
  • Others

The EMR report looks into the regional markets of flip chip like North America, Latin America, the Asia Pacific, Europe, and the Middle East and Africa.

 

Emerging Copper Pillar Bumping Flip Chip Technology to Aid the Market Growth in the Forecast Period

The copper pillar bumping technology is an emerging flip chip technology that is anticipated to drive the market growth of flip chip technology. The copper pillars are deployed in package applications for portable electronic devices due to the demand for the smaller form factor, better performance, and lower power consumption and can substantially reduce costs in many applications. The copper pillar flip chip technology uses copper posts capped with solder instead of regular solder ball bump to achieve less than 150 µm pitch. Therefore, the deployment of copper pillar bumping technology in high performance, ultra-fine pitch, and high-density interconnection in devices like transceivers, microprocessors, and power management are anticipated to aid the industry growth for flip chip.

In addition, the market demand for copper pillars can be attributed to higher I/O counts, lithography nodes below 28 µm, and the emergence of 3D packaging. Further, the properties of copper pillar technology aids in improved density connections, enhanced thermal and electrical dissipation, thus, aiding the growth prospects of the flip chip technology. Therefore, the benefits associated with copper pillar bumping is projected to drive the market growth in the forecast period.

 

Key Industry Players in the Global Flip Chip Market

The report presents a detailed analysis of the following key players in the global flip chip market, looking into their capacity, market share, and latest developments like capacity expansions, plant turnabouts and mergers and acquisitions.

  • 3M Company
  • Advanced Micro Devices, Inc.
  • Amkor Technology, Inc
  • Apple Inc.
  • Intel Corporation
  • Others

The comprehensive report looks at the micro and macro aspects of the industry. The EMR report gives an in-depth insight into the market by providing a SWOT analysis as well as an analysis of the Porter’s Five Forces Model.

 

REPORT FEATURES DETAILS
Base Year 2020
Historical Period 2016-2020
Forecast Period 2021-2026
Scope of the Report Historical and Forecast Trends, Industry Drivers and Constraints, Historical and Forecast Market Analysis by Segment- Packaging Technology, Bumping Technology, Industry Vertical, Region
Breakup by Packaging Technology 3D IC, 2.5D IC, 2D IC
Breakup by Bumping Technology Copper Pillar, Solder Bumping, Gold Bumping, Others
Breakup by Industry Vertical Electronics, Industrial, Healthcare, Automotive and Transport, IT and Telecommunication, Aerospace and Defence, Others
Breakup by Region North America, Europe, Asia Pacific, Latin America, Middle East and Africa
Market Dynamics SWOT, Porter's Five Forces, EMR’s Key Indicators for Price and Demand
Competitive Landscape Market Structure, Company Profiles- Company Overview, Product Portfolio, Demographic Reach and Achievements, Certifications
Companies Covered 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., Intel Corporation, Others
Report Price and Purchase Option Explore our purchase options that are best suited to your resources and industry needs.
Delivery Format Delivered as an attached PDF and Excel through email, with an option of receiving an editable PPT, according to the purchase option.

 

*We at Expert Market Research always thrive to give you the latest information. The numbers in the article are only indicative and may be different from the actual report.

1    Preface
2    Report Coverage – Key Segmentation and Scope
3    Report Description

    3.1    Market Definition and Outlook
    3.2    Properties and Applications
    3.3    Market Analysis
    3.4    Key Players
4    Key Assumptions
5    Executive Summary

    5.1    Overview
    5.2    Key Drivers
    5.3    Key Developments
    5.4    Competitive Structure
    5.5    Key Industrial Trends
6    Snapshot
    6.1    Global
    6.2    Regional
7    Industry Opportunities and Challenges
8    Global Flip Chip Market Analysis

    8.1    Key Industry Highlights
    8.2    Global Flip Chip Historical Market (2016-2020) 
    8.3    Global Flip Chip Market Forecast (2021-2026)
    8.4    Global Flip Chip Market by Packaging Technology
        8.4.1    3D IC
            8.4.1.1    Market Share
            8.4.1.2    Historical Trend (2016-2020)
            8.4.1.3    Forecast Trend (2021-2026)
        8.4.2    2.5D IC
            8.4.2.1    Market Share
            8.4.2.2    Historical Trend (2016-2020)
            8.4.2.3    Forecast Trend (2021-2026)
        8.4.3    2D IC
            8.4.3.1    Market Share
            8.4.3.2    Historical Trend (2016-2020)
            8.4.3.3    Forecast Trend (2021-2026)
    8.5    Global Flip Chip Market by Bumping Technology
        8.5.1    Copper Pillar
            8.5.1.1    Market Share
            8.5.1.2    Historical Trend (2016-2020)
            8.5.1.3    Forecast Trend (2021-2026)
        8.5.2    Solder Bumping
            8.5.2.1    Market Share
            8.5.2.2    Historical Trend (2016-2020)
            8.5.2.3    Forecast Trend (2021-2026)
        8.5.3    Gold Bumping
            8.5.3.1    Market Share
            8.5.3.2    Historical Trend (2016-2020)
            8.5.3.3    Forecast Trend (2021-2026)
        8.5.4    Others
    8.6    Global Flip Chip Market by Industry Vertical
        8.6.1    Electronics
            8.6.1.1    Market Share
            8.6.1.2    Historical Trend (2016-2020)
            8.6.1.3    Forecast Trend (2021-2026)
        8.6.2    Industrial
            8.6.2.1    Market Share
            8.6.2.2    Historical Trend (2016-2020)
            8.6.2.3    Forecast Trend (2021-2026)
        8.6.3    Healthcare
            8.6.3.1    Market Share
            8.6.3.2    Historical Trend (2016-2020)
            8.6.3.3    Forecast Trend (2021-2026)
        8.6.4    Automotive and Transport
            8.6.4.1    Market Share
            8.6.4.2    Historical Trend (2016-2020)
            8.6.4.3    Forecast Trend (2021-2026)
        8.6.5    IT and Telecommunication
            8.6.5.1    Market Share
            8.6.5.2    Historical Trend (2016-2020)
            8.6.5.3    Forecast Trend (2021-2026)
        8.6.6    Aerospace and Defence
            8.6.6.1    Market Share
            8.6.6.2    Historical Trend (2016-2020)
            8.6.6.3    Forecast Trend (2021-2026)
        8.6.7    Others
    8.7    Global Flip Chip Market by Region
        8.7.1    Market Share
            8.7.1.1    North America
            8.7.1.2    Europe
            8.7.1.3    Asia Pacific
            8.7.1.4    Latin America
            8.7.1.5    Middle East and Africa
9    Regional Analysis
    9.1    North America
        9.1.1    Historical Trend (2016-2020)
        9.1.2    Forecast Trend (2021-2026)
        9.1.3    Breakup by Country
            9.1.3.1    United States of America 
            9.1.3.2    Canada
    9.2    Europe
        9.2.1    Historical Trend (2016-2020)
        9.2.2    Forecast Trend (2021-2026)
        9.2.3    Breakup by Country 
            9.2.3.1    United Kingdom
            9.2.3.2    Germany
            9.2.3.3    France
            9.2.3.4    Italy
            9.2.3.5    Others
    9.3    Asia Pacific
        9.3.1    Historical Trend (2016-2020)
        9.3.2    Forecast Trend (2021-2026)
        9.3.3    Breakup by Country
            9.3.3.1    China
            9.3.3.2    Japan
            9.3.3.3    India
            9.3.3.4    ASEAN
            9.3.3.5    Australia
            9.3.3.6    Others
    9.4    Latin America
        9.4.1    Historical Trend (2016-2020)
        9.4.2    Forecast Trend (2021-2026)
        9.4.3    Breakup by Country
            9.4.3.1    Brazil
            9.4.3.2    Argentina
            9.4.3.3    Mexico
            9.4.3.4    Others
    9.5    Middle East and Africa
        9.5.1    Historical Trend (2016-2020)
        9.5.2    Forecast Trend (2021-2026)
        9.5.3    Breakup by Country
            9.5.3.1    Saudi Arabia
            9.5.3.2    United Arab Emirates
            9.5.3.3    Nigeria
            9.5.3.4    South Africa
            9.5.3.5    Others
10    Market Dynamics
    10.1    SWOT Analysis
        10.1.1    Strengths
        10.1.2    Weaknesses
        10.1.3    Opportunities
        10.1.4    Threats
    10.2    Porter’s Five Forces Analysis
        10.2.1    Supplier’s Power
        10.2.2    Buyer’s Power
        10.2.3    Threat of New Entrants
        10.2.4    Degree of Rivalry
        10.2.5    Threat of Substitutes
    10.3    EMR’s Key Indicators for Demand
    10.4    EMR’s Key Indicators for Price
11    Value Chain Analysis
12    Competitive Landscape

    12.1    Market Structure
    12.2    Company Profiles
        12.2.1    3M Company
            12.2.1.1    Company Overview
            12.2.1.2    Product Portfolio
            12.2.1.3    Demographic Reach and Achievements
            12.2.1.4    Certifications
        12.2.2    Advanced Micro Devices, Inc.
            12.2.2.1    Company Overview
            12.2.2.2    Product Portfolio
            12.2.2.3    Demographic Reach and Achievements
            12.2.2.4    Certifications
        12.2.3    Amkor Technology, Inc.
            12.2.3.1    Company Overview
            12.2.3.2    Product Portfolio
            12.2.3.3    Demographic Reach and Achievements
            12.2.3.4    Certifications
        12.2.4    Apple Inc.
            12.2.4.1    Company Overview
            12.2.4.2    Product Portfolio
            12.2.4.3    Demographic Reach and Achievements
            12.2.4.4    Certifications
        12.2.5    Intel Corporation
            12.2.5.1    Company Overview
            12.2.5.2    Product Portfolio
            12.2.5.3    Demographic Reach and Achievements
            12.2.5.4    Certifications
        12.2.6    Others
13    Industry Events and Developments

 

Additional Customisations Available

1    Manufacturing Process
    1.1    Overview
    1.2    Detailed Process Flow
    1.3    Operation Involved

 

List of Figures and Tables

1.    Global Flip Chip Market: Key Industry Highlights, 2016 and 2026
2.    Global Flip Chip Historical Market: Breakup by Packaging Technology (USD Billion), 2016-2020
3.    Global Flip Chip Market Forecast: Breakup by Packaging Technology (USD Billion), 2021-2026
4.    Global Flip Chip Historical Market: Breakup by Bumping Technology (USD Billion), 2016-2020
5.    Global Flip Chip Market Forecast: Breakup by Bumping Technology (USD Billion), 2021-2026
6.    Global Flip Chip Historical Market: Breakup by Industry Vertical (USD Billion), 2016-2020
7.    Global Flip Chip Market Forecast: Breakup by Industry Vertical (USD Billion), 2021-2026
8.    Global Flip Chip Historical Market: Breakup by Region (USD Billion), 2016-2020
9.    Global Flip Chip Market Forecast: Breakup by Region (USD Billion), 2021-2026
10.    North America Flip Chip Historical Market: Breakup by Country (USD Billion), 2016-2020
11.    North America Flip Chip Market Forecast: Breakup by Country (USD Billion), 2021-2026
12.    Europe Flip Chip Historical Market: Breakup by Country (USD Billion), 2016-2020
13.    Europe Flip Chip Market Forecast: Breakup by Country (USD Billion), 2021-2026
14.    Asia Pacific Flip Chip Historical Market: Breakup by Country (USD Billion), 2016-2020
15.    Asia Pacific Flip Chip Market Forecast: Breakup by Country (USD Billion), 2021-2026
16.    Latin America Flip Chip Historical Market: Breakup by Country (USD Billion), 2016-2020
17.    Latin America Flip Chip Market Forecast: Breakup by Country (USD Billion), 2021-2026
18.    Middle East and Africa Flip Chip Historical Market: Breakup by Country (USD Billion), 2016-2020
19.    Middle East and Africa Flip Chip Market Forecast: Breakup by Country (USD Billion), 2021-2026
20.    Global Flip Chip Market Structure

Key Questions Answered in the Report

The global flip chip market attained a value of nearly USD 26.27 billion in 2020.

The market is projected to grow at a CAGR of 6.1% in the forecast period of 2021-2026.

The market is estimated to witness a healthy growth in the forecast period of 2021-2026 to reach about USD 37.39 billion by 2026.

Surging demand for low-cost, miniature silicon packaging in electronic devices is driving the market growth for flip chip.

The copper pillar bumping technology is used to achieve high performance, ultra-fine pitch, and high-density interconnections, which is anticipated to spur market growth of flip chip.

The major regional markets for flip chip are North America, Latin America, the Asia Pacific, Europe, and the Middle East and Africa.

The different types of packaging technology are 3D IC, 2.5D IC, and 2D IC.

The different bumping technologies of the industry are copper pillar, solder bumping, and gold bumping, among others.

The significant industry verticals in the flip chip industry are electronics, industrial, healthcare, automotive and transport, IT and telecommunication, and aerospace and defence, among others.

The major players in the industry are 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., and Intel Corporation, among others.

Analyst Review

The global flip chip market attained a value of about USD 26.27 billion in 2020, driven by the deployment of flip chip technology in silicon packaging. Aided by emerging copper pillar bumping technology, the market is expected to grow at a CAGR of 6.1% in the forecast period of 2021-2026 to reach nearly USD 37.39 billion by 2026.

EMR’s meticulous research methodology delves deep into the market covering the macro and micro aspects of the industry. On the basis of packaging technology, the market can be segmented into 3D IC, 2.5D IC, and 2D IC. Based on bumping technology, the market is divided into copper pillar, solder bumping, and gold bumping, among others. The market segmentations based on industry vertical are electronics, industrial, healthcare, automotive and transport, IT and telecommunication, and aerospace and defence, among others. The major regional markets for flip chip are North America, Latin America, the Asia Pacific, Europe, and the Middle East and Africa. They key players in the industry are 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., and Intel Corporation, among others.

EMR’s research methodology uses a combination of cutting-edge analytical tools and the expertise of their highly accomplished team, thus providing their customers with market insights that are accurate, actionable and help them remain ahead of their competition.

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