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Global Printed Circuit Heat Exchanger Market Share, Size, Growth, Forecast: By Materials: Steel and Stainless Steel, Aluminium, Nickel and Nickel Based Alloys, Copper, Titanium and Titanium Alloys, Others; By Technology: Chemical Etching, Diffusion Bonding; By Application; Regional Analysis; Market Dynamics; Competitive Landscape; 2023-2028

Global Printed Circuit Heat Exchanger Market Outlook

The global printed circuit heat exchanger market is expected to grow at a CAGR of 4.60% between 2023 and 2028. Key market drivers are its properties like lightweight, efficient performance, improved safety, and need for less space for operations. 

 

Key Trends in the Market

Printed circuit heat exchangers are compact and robust heat exchangers that are primarily based on chemical etching and diffusion bonding technologies and are used for processing heat transfers. They can be used for various processing applications that need high efficiency and performance and also handle a wide variety of clean fluids. It is known for its properties such as high number of transfer units, robustness, and compactness.

 

  • Growing industrialisation in the developing regions is increasing the use and demand for the printed circuit heat exchangers which are widely used for cooling and heating purposes in various industries.
  • There is increasing demand for efficient heat energy technology owing to its economic advantages such as independence from additional equipment to operate and environmental advantages such as use of less energy and production of no or little pollution. This has largely contributed to the growth of the printed circuit heat exchanger market.
  • Technological advancements and innovations such as diffusion bonded PCHEs provide improved heat transfer and have proved to perform better in extreme pressure and temperature, and corrosive environments. These improved printed circuit heaters are gaining in popularity as compared to traditional heat exchangers.

 

Market Analysis

Based on materials, the printed circuit heat exchanger market can be divided into steel and stainless steel, aluminium, nickel and nickel-based alloys, copper, and titanium and titanium alloys, among other materials. On the basis of technology, the market is bifurcated into chemical etching and diffusion bonding. Based on application, the market is categorised into chemical processing, oil and gas, power generation, and industrial, among others. By region, the market is divided into North America, Europe, Asia Pacific, Latin America, and Middle East and Africa. 

 

The comprehensive EMR report provides an in-depth assessment of the market based on the Porter's five forces model along with giving a SWOT analysis. The report gives a detailed analysis of the following key players in the global printed circuit heat exchanger market covering their competitive landscape and latest developments like mergers, acquisitions, investments, and expansion plans.

 

  • Kobe Steel, Ltd.
  • HEXCES
  • Kelvion Holding GmbH
  • Meggitt PLC
  • Alfa Laval Inc.
  • DongHwa Entec Co., Ltd.
  • Tanktech Co., Ltd.
  • Precision Micro Ltd.
  • VPE Thermal LLC
  • Others

 

Market Share by Material

Stainless steel is increasingly used to make printed circuit heat exchangers, due to which it is projected to account for a substantial share in the printed circuit heat exchanger market. They usually are made of 300 series stainless steel because of the wide range of advantages offered. 

 

Properties of stainless steel such as its ability to operate effectively in both hot and cold temperatures without sustaining damage is a major factor helping in the growth of the stainless-steel segment in the market. They also allow PCHEs to work with heavy industrial machinery that produce large amounts of heat without influencing performance.

 

Market Share by Region

North America is expected to hold a larger share in the printed circuit heat exchanger market because of the increasing demand from industries such as petrochemicals, oil and gas, and chemicals. Initiatives and undertakings by governments such as projects as a part of high intensity thermal exchange in the North American region is also helping in the growth of the overall market. 

 

Europe is also expected to observe a significant rise in the market owing to the extensive use of printed circuit heat exchangers in the chemical industries and refineries. 

 

Competitive Landscape

Kobe Steel Ltd. is a steel manufacturing company which supplies aluminium and copper products. Its other business segments also provide wholesale supply of machinery, electronics materials, construction machinery, real estate, and other products all around the globe. It has its headquarter in Hyogo, Japan and was founded in 1905. 

 

Kelvion Holding GmbH was established in 1920 and is headquartered in Bochum, Germany. It is a machinery manufacturing company that supplies plate heat exchangers, finned tube heat exchangers, refrigeration heat exchangers, shell and tube heat exchangers, and modular cooling tower systems. It caters to various end-users such as oil and gas, data centres, refrigeration, energy, chemical companies, food and beverage companies, and various others. 

 

Meggitt PLC was founded in 1947 and is based in the United Kingdom. It is an aviation component manufacturing company that manufactures heat exchangers, sub-systems, and components for defence, energy, aerospace, transportation, oil and gas, and other selected energy markets.  They believe in delivering solutions for challenging environments and winning the trust and heart of their customers.  

 

Other market players include HEXCES, Alfa Laval Inc., DongHwa Entec Co., Ltd., Tanktech Co., Ltd., Precision Micro Ltd., and VPE Thermal LLC, among others.

 

Key Highlights of the Report

REPORT FEATURES DETAILS
Base Year 2022
Historical Period 2018-2022
Forecast Period 2023-2028
Scope of the Report

Historical and Forecast Trends, Industry Drivers and Constraints, Historical and Forecast Market Analysis by Segment:

  • Materials
  • Technology
  • Application
  • Region
Breakup by Materials
  • Steel and Stainless Steel
  • Aluminium
  • Nickel and Nickel Based Alloys
  • Copper
  • Titanium and Titanium Alloys
  • Others
Breakup by Technology
  • Chemical Etching
  • Diffusion Bonding
Breakup by Application
  • Chemical Processing
  • Oil and Gas
  • Power Generation
  • Industrial
  • Others
Breakup by Region
  • North America
    • United States of America 
    • Canada
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Others
  • Asia Pacific
    • China
    • Japan
    • India
    • ASEAN
    • Australia
    • Others
  • Latin America
    • Brazil
    • Argentina
    • Mexico
    • Others
  • Middle East and Africa
    • Saudi Arabia
    • United Arab Emirates
    • Nigeria
    • South Africa
    • Others
Market Dynamics
  • SWOT
  • Porter's Five Forces
  • Key Indicators for Demand
  • Key Indicators for Price
Competitive Landscape
  • Market Structure
  • Company Profiles
    • Company Overview
    • Product Portfolio
    • Demographic Reach and Achievements
    • Certifications
Companies Covered
  • Kobe Steel, Ltd.
  • HEXCES
  • Kelvion Holding GmbH
  • Meggitt PLC
  • Alfa Laval Inc.
  • DongHwa Entec Co., Ltd
  • Tanktech Co., Ltd.
  • Precision Micro Ltd.
  • VPE Thermal LLC,
  • Others

 

*At Expert Market Research, we strive to always give you current and accurate information. The numbers depicted in the description are indicative and may differ from the actual numbers in the final EMR report.

1    Preface
2    Report Coverage – Key Segmentation and Scope
3    Report Description

    3.1    Market Definition and Outlook
    3.2    Properties and Applications
    3.3    Market Analysis
    3.4    Key Players
4    Key Assumptions
5    Executive Summary

    5.1    Overview
    5.2    Key Drivers
    5.3    Key Developments
    5.4    Competitive Structure
    5.5    Key Industrial Trends
6    Market Snapshot
    6.1    Global
    6.2    Regional
7    Opportunities and Challenges in the Market
8    Global Printed Circuit Heat Exchanger Market Analysis

    8.1    Key Industry Highlights
    8.2    Global Printed Circuit Heat Exchanger Historical Market (2018-2022) 
    8.3    Global Printed Circuit Heat Exchanger Market Forecast (2023-2028)
    8.4    Global Printed Circuit Heat Exchanger Market by Materials
        8.4.1    Steel and Stainless Steel
            8.4.1.1    Market Share
            8.4.1.2    Historical Trend (2018-2022)
            8.4.1.3    Forecast Trend (2023-2028)
        8.4.2    Aluminium
            8.4.2.1    Market Share
            8.4.2.2    Historical Trend (2018-2022)
            8.4.2.3    Forecast Trend (2023-2028)
        8.4.3    Nickel and Nickel Based Alloys
            8.4.3.1    Market Share
            8.4.3.2    Historical Trend (2018-2022)
            8.4.3.3    Forecast Trend (2023-2028)
        8.4.4    Copper
            8.4.4.1    Market Share
            8.4.4.2    Historical Trend (2018-2022)
            8.4.4.3    Forecast Trend (2023-2028)
        8.4.5    Titanium and Titanium Alloys
            8.4.5.1    Market Share
            8.4.5.2    Historical Trend (2018-2022)
            8.4.5.3    Forecast Trend (2023-2028)
        8.4.6    Others
    8.5    Global Printed Circuit Heat Exchanger Market by Technology
        8.5.1    Chemical Etching 
            8.5.1.1    Market Share
            8.5.1.2    Historical Trend (2018-2022)
            8.5.1.3    Forecast Trend (2023-2028)
        8.5.2    Diffusion Bonding
            8.5.2.1    Market Share
            8.5.2.2    Historical Trend (2018-2022)
            8.5.2.3    Forecast Trend (2023-2028)
    8.6    Global Printed Circuit Heat Exchanger Market by Application
        8.6.1    Chemical Processing
            8.6.1.1    Market Share
            8.6.1.2    Historical Trend (2018-2022)
            8.6.1.3    Forecast Trend (2023-2028)
        8.6.2    Oil and Gas
            8.6.2.1    Market Share
            8.6.2.2    Historical Trend (2018-2022)
            8.6.2.3    Forecast Trend (2023-2028)
        8.6.3    Power Generation
            8.6.3.1    Market Share
            8.6.3.2    Historical Trend (2018-2022)
            8.6.3.3    Forecast Trend (2023-2028)
        8.6.4    Industrial
            8.6.4.1    Market Share
            8.6.4.2    Historical Trend (2018-2022)
            8.6.4.3    Forecast Trend (2023-2028)
        8.6.5    Others
    8.7    Global Printed Circuit Heat Exchanger Market by Region
        8.7.1    North America
            8.7.1.1    Market Share
            8.7.1.2    Historical Trend (2018-2022) 
            8.7.1.3    Forecast Trend (2023-2028)
        8.7.2    Europe
            8.7.2.1    Market Share
            8.7.2.2    Historical Trend (2018-2022) 
            8.7.2.3    Forecast Trend (2023-2028)
        8.7.3    Asia Pacific
            8.7.3.1    Market Share
            8.7.3.2    Historical Trend (2018-2022) 
            8.7.3.3    Forecast Trend (2023-2028)
        8.7.4    Latin America
            8.7.4.1    Market Share
            8.7.4.2    Historical Trend (2018-2022) 
            8.7.4.3    Forecast Trend (2023-2028)
        8.7.5    Middle East and Africa
            8.7.5.1    Market Share
            8.7.5.2    Historical Trend (2018-2022) 
            8.7.5.3    Forecast Trend (2023-2028)
9    North America Printed Circuit Heat Exchanger Market Analysis
    9.1    United States of America 
        9.1.1    Market Share
        9.1.2    Historical Trend (2018-2022) 
        9.1.3    Forecast Trend (2023-2028)
    9.2    Canada
        9.2.1    Market Share
        9.2.2    Historical Trend (2018-2022) 
        9.2.3    Forecast Trend (2023-2028)
10    Europe Printed Circuit Heat Exchanger Market Analysis
    10.1    United Kingdom
        10.1.1    Market Share
        10.1.2    Historical Trend (2018-2022) 
        10.1.3    Forecast Trend (2023-2028)
    10.2    Germany
        10.2.1    Market Share
        10.2.2    Historical Trend (2018-2022) 
        10.2.3    Forecast Trend (2023-2028)
    10.3    France
        10.3.1    Market Share
        10.3.2    Historical Trend (2018-2022) 
        10.3.3    Forecast Trend (2023-2028)
    10.4    Italy
        10.4.1    Market Share
        10.4.2    Historical Trend (2018-2022) 
        10.4.3    Forecast Trend (2023-2028)
    10.5    Others
11    Asia Pacific Printed Circuit Heat Exchanger Market Analysis
    11.1    China
        11.1.1    Market Share
        11.1.2    Historical Trend (2018-2022) 
        11.1.3    Forecast Trend (2023-2028)
    11.2    Japan
        11.2.1    Market Share
        11.2.2    Historical Trend (2018-2022) 
        11.2.3    Forecast Trend (2023-2028)
    11.3    India
        11.3.1    Market Share
        11.3.2    Historical Trend (2018-2022) 
        11.3.3    Forecast Trend (2023-2028)
    11.4    ASEAN
        11.4.1    Market Share
        11.4.2    Historical Trend (2018-2022) 
        11.4.3    Forecast Trend (2023-2028)
    11.5    Australia
        11.5.1    Market Share
        11.5.2    Historical Trend (2018-2022) 
        11.5.3    Forecast Trend (2023-2028)
    11.6    Others
12    Latin America Printed Circuit Heat Exchanger Market Analysis
    12.1    Brazil
        12.1.1    Market Share
        12.1.2    Historical Trend (2018-2022) 
        12.1.3    Forecast Trend (2023-2028)
    12.2    Argentina
        12.2.1    Market Share
        12.2.2    Historical Trend (2018-2022) 
        12.2.3    Forecast Trend (2023-2028)
    12.3    Mexico
        12.3.1    Market Share
        12.3.2    Historical Trend (2018-2022) 
        12.3.3    Forecast Trend (2023-2028)
    12.4    Others
13    Middle East and Africa Printed Circuit Heat Exchanger Market Analysis
    13.1    Saudi Arabia
        13.1.1    Market Share
        13.1.2    Historical Trend (2018-2022) 
        13.1.3    Forecast Trend (2023-2028)
    13.2    United Arab Emirates
        13.2.1    Market Share
        13.2.2    Historical Trend (2018-2022) 
        13.2.3    Forecast Trend (2023-2028)
    13.3    Nigeria
        13.3.1    Market Share
        13.3.2    Historical Trend (2018-2022) 
        13.3.3    Forecast Trend (2023-2028)
    13.4    South Africa
        13.4.1    Market Share
        13.4.2    Historical Trend (2018-2022) 
        13.4.3    Forecast Trend (2023-2028)
    13.5    Others
14    Market Dynamics
    14.1    SWOT Analysis
        14.1.1    Strengths
        14.1.2    Weaknesses
        14.1.3    Opportunities
        14.1.4    Threats
    14.2    Porter’s Five Forces Analysis
        14.2.1    Supplier’s Power
        14.2.2    Buyer’s Power
        14.2.3    Threat of New Entrants
        14.2.4    Degree of Rivalry
        14.2.5    Threat of Substitutes
    14.3    Key Indicators for Demand
    14.4    Key Indicators for Price
15    Competitive Landscape
    15.1    Market Structure
    15.2    Company Profiles
        15.2.1    Kobe Steel, Ltd.
            15.2.1.1    Company Overview
            15.2.1.2    Product Portfolio
            15.2.1.3    Demographic Reach and Achievements
            15.2.1.4    Certifications
        15.2.2    HEXCES
            15.2.2.1    Company Overview
            15.2.2.2    Product Portfolio
            15.2.2.3    Demographic Reach and Achievements
            15.2.2.4    Certifications
        15.2.3    Kelvion Holding GmbH
            15.2.3.1    Company Overview
            15.2.3.2    Product Portfolio
            15.2.3.3    Demographic Reach and Achievements
            15.2.3.4    Certifications
        15.2.4    Meggitt PLC
            15.2.4.1    Company Overview
            15.2.4.2    Product Portfolio
            15.2.4.3    Demographic Reach and Achievements
            15.2.4.4    Certifications
        15.2.5    Alfa Laval Inc.
            15.2.5.1    Company Overview
            15.2.5.2    Product Portfolio
            15.2.5.3    Demographic Reach and Achievements
            15.2.5.4    Certifications
        15.2.6    DongHwa Entec Co., Ltd
            15.2.6.1    Company Overview
            15.2.6.2    Product Portfolio
            15.2.6.3    Demographic Reach and Achievements
            15.2.6.4    Certifications
        15.2.7    Tanktech Co., Ltd.
            15.2.7.1    Company Overview
            15.2.7.2    Product Portfolio
            15.2.7.3    Demographic Reach and Achievements
            15.2.7.4    Certifications
        15.2.8    Precision Micro Ltd.
            15.2.8.1    Company Overview
            15.2.8.2    Product Portfolio
            15.2.8.3    Demographic Reach and Achievements
            15.2.8.4    Certifications
        15.2.9    VPE Thermal LLC,
            15.2.9.1    Company Overview
            15.2.9.2    Product Portfolio
            15.2.9.3    Demographic Reach and Achievements
            15.2.9.4    Certifications
        15.2.10    Others
16    Key Trends and Developments in the Market

 

List of Figures and Tables

1.    Global Printed CirPcuit Heat Exchanger Market: Key Industry Highlights, 2018 and 2028
2.    Global Printed Circuit Heat Exchanger Historical Market: Breakup by Materials (USD Million), 2018-2022
3.    Global Printed Circuit Heat Exchanger Market Forecast: Breakup by Materials (USD Million), 2023-2028
4.    Global Printed Circuit Heat Exchanger Historical Market: Breakup by Technology (USD Million), 2018-2022
5.    Global Printed Circuit Heat Exchanger Market Forecast: Breakup by Technology (USD Million), 2023-2028
6.    Global Printed Circuit Heat Exchanger Historical Market: Breakup by Application (USD Million), 2018-2022
7.    Global Printed Circuit Heat Exchanger Market Forecast: Breakup by Application (USD Million), 2023-2028
8.    Global Printed Circuit Heat Exchanger Historical Market: Breakup by Region (USD Million), 2018-2022
9.    Global Printed Circuit Heat Exchanger Market Forecast: Breakup by Region (USD Million), 2023-2028
10.    North America Printed Circuit Heat Exchanger Historical Market: Breakup by Country (USD Million), 2018-2022
11.    North America Printed Circuit Heat Exchanger Market Forecast: Breakup by Country (USD Million), 2023-2028
12.    Europe Printed Circuit Heat Exchanger Historical Market: Breakup by Country (USD Million), 2018-2022
13.    Europe Printed Circuit Heat Exchanger Market Forecast: Breakup by Country (USD Million), 2023-2028
14.    Asia Pacific Printed Circuit Heat Exchanger Historical Market: Breakup by Country (USD Million), 2018-2022
15.    Asia Pacific Printed Circuit Heat Exchanger Market Forecast: Breakup by Country (USD Million), 2023-2028
16.    Latin America Printed Circuit Heat Exchanger Historical Market: Breakup by Country (USD Million), 2018-2022
17.    Latin America Printed Circuit Heat Exchanger Market Forecast: Breakup by Country (USD Million), 2023-2028
18.    Middle East and Africa Printed Circuit Heat Exchanger Historical Market: Breakup by Country (USD Million), 2018-2022
19.    Middle East and Africa Printed Circuit Heat Exchanger Market Forecast: Breakup by Country (USD Million), 2023-2028
20.    Global Printed Circuit Heat Exchanger Market Structure

Key Questions Answered in the Report

The global market for printed circuit heat exchangers is expected to grow at a CAGR of 4.60% between 2023 and 2028.

The major market drivers include the increasing demand for efficient heat energy technology and the properties of printed circuit heat exchangers such as lightweight, efficient performance, improved safety, and less need for space for operations.

The key trends of the market are growing industrialisation, technological advancement, and wider applications of printed circuit heat exchangers.

The key market players include Kobe Steel, Ltd., HEXCES, Kelvion Holding GmbH, Meggitt PLC, Alfa Laval Inc., DongHwa Entec Co., Ltd., Tanktech Co., Ltd., Precision Micro Ltd., and VPE Thermal LLC, among others.

Printed circuit heat exchangers are compact and robust heat exchangers that are primarily based on chemical etching and diffusion bonding technologies and are used for processing heat transfers.

The primary applications of printed circuit heat exchangers are chemical processing, oil and gas, power generation, and industrial, among others.

The global printed circuit heat exchanger market is segmented based on materials, technology, application, and region.

Printed circuit heat exchanger properties are a high number of transfer units, robustness, and compactness.

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