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Global Flip Chip Market Size, Share, Trends, Growth, Report: By Packaging Technology: 3D IC, 2.5D IC, 2D IC; By Bumping Technology: Copper Pillar, Solder Bumping, Gold Bumping, Others; By Industry Vertical: Electronics, Industrial, Healthcare, Automotive and Transport, Others; Regional Analysis; Competitive Landscape; 2024-2032
Flip Chip Market Growth
A flip chip is a chip packaging technique that refers to an electronic component or semiconductor that can be installed onto an underlying substance and the chips consist of conductive polymers, by virtue of which, an electrical connection is established. Instead of wire bonding, the chip is flipped over so that its top side faces down towards the substrate or circuit board which allows for a much higher density of connections.
The automotive sector’s rapid adoption of electronics for safety, navigation, infotainment, and autonomous driving systems has driven the need for reliable and high-performance semiconductor packaging. Flip chips offer the durability and performance needed for these applications, which boosts the flip chip market development. As data centres evolve to handle more data and perform more complex computations, the demand for high-speed, efficient computing power increases and flip chip technology supports this growth by providing better thermal management and faster data transmission. Moreover, as consumer electronics, like smartphones, tablets, and wearables, become more compact while requiring higher performance, flip chip technology offers a solution due to its ability to enable smaller, more efficient packages and better electrical performance.
Flip Chip Market Report Snapshots
Flip Chip Market Regional Analysis
*While we strive to always give you current and accurate information, the numbers depicted on the website are indicative and may differ from the actual numbers in the main report. At Expert Market Research, we aim to bring you the latest insights and trends in the market. Using our analyses and forecasts, stakeholders can understand the market dynamics, navigate challenges, and capitalize on opportunities to make data-driven strategic decisions.
1 Preface
2 Report Coverage – Key Segmentation and Scope
3 Report Description
3.1 Market Definition and Outlook
3.2 Properties and Applications
3.3 Market Analysis
3.4 Key Players
4 Key Assumptions
5 Executive Summary
5.1 Overview
5.2 Key Drivers
5.3 Key Developments
5.4 Competitive Structure
5.5 Key Industrial Trends
6 Snapshot
6.1 Global
6.2 Regional
7 Opportunities and Challenges in the Market
8 Global Flip Chip Market Analysis
8.1 Key Industry Highlights
8.2 Global Flip Chip Historical Market (2018-2023)
8.3 Global Flip Chip Market Forecast (2024-2032)
8.4 Global Flip Chip Market by Packaging Technology
8.4.1 3D IC
8.4.1.1 Historical Trend (2018-2023)
8.4.1.2 Forecast Trend (2024-2032)
8.4.2 2.5D IC
8.4.2.1 Historical Trend (2018-2023)
8.4.2.2 Forecast Trend (2024-2032)
8.4.3 2D IC
8.4.3.1 Historical Trend (2018-2023)
8.4.3.2 Forecast Trend (2024-2032)
8.5 Global Flip Chip Market by Bumping Technology
8.5.1 Copper Pillar
8.5.1.1 Historical Trend (2018-2023)
8.5.1.2 Forecast Trend (2024-2032)
8.5.2 Solder Bumping
8.5.2.1 Historical Trend (2018-2023)
8.5.2.2 Forecast Trend (2024-2032)
8.5.3 Gold Bumping
8.5.3.1 Historical Trend (2018-2023)
8.5.3.2 Forecast Trend (2024-2032)
8.5.4 Others
8.6 Global Flip Chip Market by Industry Vertical
8.6.1 Electronics
8.6.1.1 Historical Trend (2018-2023)
8.6.1.2 Forecast Trend (2024-2032)
8.6.2 Industrial
8.6.2.1 Historical Trend (2018-2023)
8.6.2.2 Forecast Trend (2024-2032)
8.6.3 Healthcare
8.6.3.1 Historical Trend (2018-2023)
8.6.3.2 Forecast Trend (2024-2032)
8.6.4 Automotive and Transport
8.6.4.1 Historical Trend (2018-2023)
8.6.4.2 Forecast Trend (2024-2032)
8.6.5 IT and Telecommunication
8.6.5.1 Historical Trend (2018-2023)
8.6.5.2 Forecast Trend (2024-2032)
8.6.6 Aerospace and Defence
8.6.6.1 Historical Trend (2018-2023)
8.6.6.2 Forecast Trend (2024-2032)
8.6.7 Others
8.7 Global Flip Chip Market by Region
8.7.1 North America
8.7.1.1 Historical Trend (2018-2023)
8.7.1.2 Forecast Trend (2024-2032)
8.7.2 Europe
8.7.2.1 Historical Trend (2018-2023)
8.7.2.2 Forecast Trend (2024-2032)
8.7.3 Asia Pacific
8.7.3.1 Historical Trend (2018-2023)
8.7.3.2 Forecast Trend (2024-2032)
8.7.4 Latin America
8.7.4.1 Historical Trend (2018-2023)
8.7.4.2 Forecast Trend (2024-2032)
8.7.5 Middle East and Africa
8.7.5.1 Historical Trend (2018-2023)
8.7.5.2 Forecast Trend (2024-2032)
9 North America Flip Chip Market Analysis
9.1 United States of America
9.1.1 Historical Trend (2018-2023)
9.1.2 Forecast Trend (2024-2032)
9.2 Canada
9.2.1 Historical Trend (2018-2023)
9.2.2 Forecast Trend (2024-2032)
10 Europe Flip Chip Market Analysis
10.1 United Kingdom
10.1.1 Historical Trend (2018-2023)
10.1.2 Forecast Trend (2024-2032)
10.2 Germany
10.2.1 Historical Trend (2018-2023)
10.2.2 Forecast Trend (2024-2032)
10.3 France
10.3.1 Historical Trend (2018-2023)
10.3.2 Forecast Trend (2024-2032)
10.4 Italy
10.4.1 Historical Trend (2018-2023)
10.4.2 Forecast Trend (2024-2032)
10.5 Others
11 Asia Pacific Flip Chip Market Analysis
11.1 China
11.1.1 Historical Trend (2018-2023)
11.1.2 Forecast Trend (2024-2032)
11.2 Japan
11.2.1 Historical Trend (2018-2023)
11.2.2 Forecast Trend (2024-2032)
11.3 India
11.3.1 Historical Trend (2018-2023)
11.3.2 Forecast Trend (2024-2032)
11.4 ASEAN
11.4.1 Historical Trend (2018-2023)
11.4.2 Forecast Trend (2024-2032)
11.5 Australia
11.5.1 Historical Trend (2018-2023)
11.5.2 Forecast Trend (2024-2032)
11.6 Others
12 Latin America Flip Chip Market Analysis
12.1 Brazil
12.1.1 Historical Trend (2018-2023)
12.1.2 Forecast Trend (2024-2032)
12.2 Argentina
12.2.1 Historical Trend (2018-2023)
12.2.2 Forecast Trend (2024-2032)
12.3 Mexico
12.3.1 Historical Trend (2018-2023)
12.3.2 Forecast Trend (2024-2032)
12.4 Others
13 Middle East and Africa Flip Chip Market Analysis
13.1 Saudi Arabia
13.1.1 Historical Trend (2018-2023)
13.1.2 Forecast Trend (2024-2032)
13.2 United Arab Emirates
13.2.1 Historical Trend (2018-2023)
13.2.2 Forecast Trend (2024-2032)
13.3 Nigeria
13.3.1 Historical Trend (2018-2023)
13.3.2 Forecast Trend (2024-2032)
13.4 South Africa
13.4.1 Historical Trend (2018-2023)
13.4.2 Forecast Trend (2024-2032)
13.5 Others
14 Market Dynamics
14.1 SWOT Analysis
14.1.1 Strengths
14.1.2 Weaknesses
14.1.3 Opportunities
14.1.4 Threats
14.2 Porter’s Five Forces Analysis
14.2.1 Supplier’s Power
14.2.2 Buyer’s Power
14.2.3 Threat of New Entrants
14.2.4 Degree of Rivalry
14.2.5 Threat of Substitutes
14.3 Key Indicators for Demand
14.4 Key Indicators for Price
15 Value Chain Analysis
16 Competitive Landscape
16.1 Market Structure
16.2 Company Profiles
16.2.1 3M Company
16.2.1.1 Company Overview
16.2.1.2 Product Portfolio
16.2.1.3 Demographic Reach and Achievements
16.2.1.4 Certifications
16.2.2 Advanced Micro Devices, Inc.
16.2.2.1 Company Overview
16.2.2.2 Product Portfolio
16.2.2.3 Demographic Reach and Achievements
16.2.2.4 Certifications
16.2.3 Amkor Technology, Inc.
16.2.3.1 Company Overview
16.2.3.2 Product Portfolio
16.2.3.3 Demographic Reach and Achievements
16.2.3.4 Certifications
16.2.4 Apple Inc.
16.2.4.1 Company Overview
16.2.4.2 Product Portfolio
16.2.4.3 Demographic Reach and Achievements
16.2.4.4 Certifications
16.2.5 Intel Corporation
16.2.5.1 Company Overview
16.2.5.2 Product Portfolio
16.2.5.3 Demographic Reach and Achievements
16.2.5.4 Certifications
16.2.6 Others
17 Key Trends and Developments in the Market
Additional Customisations Available
1 Manufacturing Process
1.1 Overview
1.2 Detailed Process Flow
1.3 Operation Involved
List of Key Figures and Tables
1. Global Flip Chip Market: Key Industry Highlights, 2018 and 2032
2. Global Flip Chip Historical Market: Breakup by Packaging Technology (USD Billion), 2018-2023
3. Global Flip Chip Market Forecast: Breakup by Packaging Technology (USD Billion), 2024-2032
4. Global Flip Chip Historical Market: Breakup by Bumping Technology (USD Billion), 2018-2023
5. Global Flip Chip Market Forecast: Breakup by Bumping Technology (USD Billion), 2024-2032
6. Global Flip Chip Historical Market: Breakup by Industry Vertical (USD Billion), 2018-2023
7. Global Flip Chip Market Forecast: Breakup by Industry Vertical (USD Billion), 2024-2032
8. Global Flip Chip Historical Market: Breakup by Region (USD Billion), 2018-2023
9. Global Flip Chip Market Forecast: Breakup by Region (USD Billion), 2024-2032
10. North America Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
11. North America Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
12. Europe Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
13. Europe Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
14. Asia Pacific Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
15. Asia Pacific Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
16. Latin America Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
17. Latin America Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
18. Middle East and Africa Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
19. Middle East and Africa Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
20. Global Flip Chip Market Structure
Key Questions Answered in the Report
The global flip chip market attained a value of nearly USD 31.37 billion in 2023.
The market is projected to grow at a CAGR of 6.1% in the forecast period of 2024-2032.
The market is estimated to witness a healthy growth in the forecast period of 2024-2032 to reach about USD 53.34 billion by 2032.
The major market drivers include the growing demand for low-cost and miniature silicon packaging in electronic devices and the rising penetration of advanced packaging solutions in electronics.
The growing utilisation of copper pillar bumping technology and increasing R&D activities by leading companies are the key trends fuelling the market growth.
The major regional markets for flip chip are North America, Latin America, the Asia Pacific, Europe, and the Middle East and Africa.
The different packaging technologies considered in the market report are 3D IC, 2.5D IC, and 2D IC.
Copper pillar, solder bumping, and gold bumping, among others, are the various bumping technologies included in the market report.
The significant industry verticals considered in the market report are electronics, industrial, healthcare, automotive and transport, IT and telecommunication, and aerospace and defence, among others.
The major players in the market are 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., and Intel Corporation, among others.
Analyst Review
The global flip chip market attained a value of about USD 31.37 billion in 2023, driven by the deployment of flip chip technology in silicon packaging. Aided by emerging copper pillar bumping technology, the market is expected to grow at a CAGR of 6.1% in the forecast period of 2024-2032 to reach nearly USD 53.34 billion by 2032.
EMR’s meticulous research methodology delves deep into the market covering the macro and micro aspects of the industry. On the basis of packaging technology, the market can be segmented into 3D IC, 2.5D IC, and 2D IC. Based on bumping technology, the market is divided into copper pillar, solder bumping, and gold bumping, among others. The market segmentations based on industry vertical are electronics, industrial, healthcare, automotive and transport, IT and telecommunication, and aerospace and defence, among others. The major regional markets for flip chip are North America, Latin America, the Asia Pacific, Europe, and the Middle East and Africa. They key players in the industry are 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., and Intel Corporation, among others.
EMR’s research methodology uses a combination of cutting-edge analytical tools and the expertise of their highly accomplished team, thus providing their customers with market insights that are accurate, actionable and help them remain ahead of their competition.
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