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Global Flip Chip Market Size, Share, Trends, Growth, Report: By Packaging Technology: 3D IC, 2.5D IC, 2D IC; By Bumping Technology: Copper Pillar, Solder Bumping, Gold Bumping, Others; By Industry Vertical: Electronics, Industrial, Healthcare, Automotive and Transport, Others; Regional Analysis; Competitive Landscape; 2024-2032
Flip Chip Market Share
Demand for copper pillar is rising owing to its favourable properties such as cost-effectiveness
The copper pillar occupies a significant market share. The copper pillars are deployed in package applications for portable electronic devices due to the demand for the smaller form factor, better performance, and lower power consumption and can substantially reduce costs in many applications. The copper pillar flip chip technology uses copper posts capped with solder instead of regular solder ball bumps to achieve less than 150 µm pitch. Therefore, the deployment of copper pillar bumping technology in high performance, ultra-fine pitch, and high-density interconnection in devices like transceivers, microprocessors, and power management is anticipated to aid the market growth.
In addition, the demand for copper pillars can be attributed to higher I/O counts, lithography nodes below 28 µm, and the emergence of 3D packaging. Further, the properties of copper pillar technology aid in improved density connections, and enhanced thermal and electrical dissipation, thus, aiding the growth prospects of the flip chip technology.
The gold bumping segment is anticipated to witness robust growth in the flip chip technology market in the coming years. Gold is one of the best conductors of electricity, making it ideal for ensuring minimal signal loss and high performance in semiconductor devices and this property is crucial in high-frequency applications where signal integrity is paramount. Gold is also highly resistant to oxidation and corrosion, which makes gold-bumped flip chips more reliable over time, especially in harsh environments and this durability is essential for automotive, aerospace, medical, and industrial applications where longevity and reliability are critical.
The electronics sector maintains its dominance in the market due to the rising trend of miniaturisation in this sector which fuels the demand for flip chip
The electronics sector holds a substantial share of the flip chip market. The demand for flip chips in this sector is rising due to the surging demand for miniaturisation and high performance in electronic devices. The requirement for low-cost packaging technologies is spurring the demand for silicon photonics in optical interconnections, resulting in a surging demand for scalable and tolerant optical interfacing methods based on flip-chip bonding. Silicon packaging is used in a number of electronic devices due to reduced cost, high-density packaging, and improved reliance properties of flip chips. Further, as the technology eliminates the need for wire bonding, it also aids in the compact designs of electronic devices. Hence, the strong penetration of advanced packaging technology in electronics is positively influencing the segment growth.
The IT (Information Technology) and telecommunication sectors are expected to grow robustly in the flip-chip market in the forecast period. IT and telecommunication systems require high-speed data processing and transmission. Flip chip technology enables higher performance than traditional wire-bonded connections due to shorter interconnect distances, which reduces signal delay and increases the speed of electrical signals.
Flip Chip Market Report Snapshots
Flip Chip Market Regional Analysis
*While we strive to always give you current and accurate information, the numbers depicted on the website are indicative and may differ from the actual numbers in the main report. At Expert Market Research, we aim to bring you the latest insights and trends in the market. Using our analyses and forecasts, stakeholders can understand the market dynamics, navigate challenges, and capitalize on opportunities to make data-driven strategic decisions.
1 Preface
2 Report Coverage – Key Segmentation and Scope
3 Report Description
3.1 Market Definition and Outlook
3.2 Properties and Applications
3.3 Market Analysis
3.4 Key Players
4 Key Assumptions
5 Executive Summary
5.1 Overview
5.2 Key Drivers
5.3 Key Developments
5.4 Competitive Structure
5.5 Key Industrial Trends
6 Snapshot
6.1 Global
6.2 Regional
7 Opportunities and Challenges in the Market
8 Global Flip Chip Market Analysis
8.1 Key Industry Highlights
8.2 Global Flip Chip Historical Market (2018-2023)
8.3 Global Flip Chip Market Forecast (2024-2032)
8.4 Global Flip Chip Market by Packaging Technology
8.4.1 3D IC
8.4.1.1 Historical Trend (2018-2023)
8.4.1.2 Forecast Trend (2024-2032)
8.4.2 2.5D IC
8.4.2.1 Historical Trend (2018-2023)
8.4.2.2 Forecast Trend (2024-2032)
8.4.3 2D IC
8.4.3.1 Historical Trend (2018-2023)
8.4.3.2 Forecast Trend (2024-2032)
8.5 Global Flip Chip Market by Bumping Technology
8.5.1 Copper Pillar
8.5.1.1 Historical Trend (2018-2023)
8.5.1.2 Forecast Trend (2024-2032)
8.5.2 Solder Bumping
8.5.2.1 Historical Trend (2018-2023)
8.5.2.2 Forecast Trend (2024-2032)
8.5.3 Gold Bumping
8.5.3.1 Historical Trend (2018-2023)
8.5.3.2 Forecast Trend (2024-2032)
8.5.4 Others
8.6 Global Flip Chip Market by Industry Vertical
8.6.1 Electronics
8.6.1.1 Historical Trend (2018-2023)
8.6.1.2 Forecast Trend (2024-2032)
8.6.2 Industrial
8.6.2.1 Historical Trend (2018-2023)
8.6.2.2 Forecast Trend (2024-2032)
8.6.3 Healthcare
8.6.3.1 Historical Trend (2018-2023)
8.6.3.2 Forecast Trend (2024-2032)
8.6.4 Automotive and Transport
8.6.4.1 Historical Trend (2018-2023)
8.6.4.2 Forecast Trend (2024-2032)
8.6.5 IT and Telecommunication
8.6.5.1 Historical Trend (2018-2023)
8.6.5.2 Forecast Trend (2024-2032)
8.6.6 Aerospace and Defence
8.6.6.1 Historical Trend (2018-2023)
8.6.6.2 Forecast Trend (2024-2032)
8.6.7 Others
8.7 Global Flip Chip Market by Region
8.7.1 North America
8.7.1.1 Historical Trend (2018-2023)
8.7.1.2 Forecast Trend (2024-2032)
8.7.2 Europe
8.7.2.1 Historical Trend (2018-2023)
8.7.2.2 Forecast Trend (2024-2032)
8.7.3 Asia Pacific
8.7.3.1 Historical Trend (2018-2023)
8.7.3.2 Forecast Trend (2024-2032)
8.7.4 Latin America
8.7.4.1 Historical Trend (2018-2023)
8.7.4.2 Forecast Trend (2024-2032)
8.7.5 Middle East and Africa
8.7.5.1 Historical Trend (2018-2023)
8.7.5.2 Forecast Trend (2024-2032)
9 North America Flip Chip Market Analysis
9.1 United States of America
9.1.1 Historical Trend (2018-2023)
9.1.2 Forecast Trend (2024-2032)
9.2 Canada
9.2.1 Historical Trend (2018-2023)
9.2.2 Forecast Trend (2024-2032)
10 Europe Flip Chip Market Analysis
10.1 United Kingdom
10.1.1 Historical Trend (2018-2023)
10.1.2 Forecast Trend (2024-2032)
10.2 Germany
10.2.1 Historical Trend (2018-2023)
10.2.2 Forecast Trend (2024-2032)
10.3 France
10.3.1 Historical Trend (2018-2023)
10.3.2 Forecast Trend (2024-2032)
10.4 Italy
10.4.1 Historical Trend (2018-2023)
10.4.2 Forecast Trend (2024-2032)
10.5 Others
11 Asia Pacific Flip Chip Market Analysis
11.1 China
11.1.1 Historical Trend (2018-2023)
11.1.2 Forecast Trend (2024-2032)
11.2 Japan
11.2.1 Historical Trend (2018-2023)
11.2.2 Forecast Trend (2024-2032)
11.3 India
11.3.1 Historical Trend (2018-2023)
11.3.2 Forecast Trend (2024-2032)
11.4 ASEAN
11.4.1 Historical Trend (2018-2023)
11.4.2 Forecast Trend (2024-2032)
11.5 Australia
11.5.1 Historical Trend (2018-2023)
11.5.2 Forecast Trend (2024-2032)
11.6 Others
12 Latin America Flip Chip Market Analysis
12.1 Brazil
12.1.1 Historical Trend (2018-2023)
12.1.2 Forecast Trend (2024-2032)
12.2 Argentina
12.2.1 Historical Trend (2018-2023)
12.2.2 Forecast Trend (2024-2032)
12.3 Mexico
12.3.1 Historical Trend (2018-2023)
12.3.2 Forecast Trend (2024-2032)
12.4 Others
13 Middle East and Africa Flip Chip Market Analysis
13.1 Saudi Arabia
13.1.1 Historical Trend (2018-2023)
13.1.2 Forecast Trend (2024-2032)
13.2 United Arab Emirates
13.2.1 Historical Trend (2018-2023)
13.2.2 Forecast Trend (2024-2032)
13.3 Nigeria
13.3.1 Historical Trend (2018-2023)
13.3.2 Forecast Trend (2024-2032)
13.4 South Africa
13.4.1 Historical Trend (2018-2023)
13.4.2 Forecast Trend (2024-2032)
13.5 Others
14 Market Dynamics
14.1 SWOT Analysis
14.1.1 Strengths
14.1.2 Weaknesses
14.1.3 Opportunities
14.1.4 Threats
14.2 Porter’s Five Forces Analysis
14.2.1 Supplier’s Power
14.2.2 Buyer’s Power
14.2.3 Threat of New Entrants
14.2.4 Degree of Rivalry
14.2.5 Threat of Substitutes
14.3 Key Indicators for Demand
14.4 Key Indicators for Price
15 Value Chain Analysis
16 Competitive Landscape
16.1 Market Structure
16.2 Company Profiles
16.2.1 3M Company
16.2.1.1 Company Overview
16.2.1.2 Product Portfolio
16.2.1.3 Demographic Reach and Achievements
16.2.1.4 Certifications
16.2.2 Advanced Micro Devices, Inc.
16.2.2.1 Company Overview
16.2.2.2 Product Portfolio
16.2.2.3 Demographic Reach and Achievements
16.2.2.4 Certifications
16.2.3 Amkor Technology, Inc.
16.2.3.1 Company Overview
16.2.3.2 Product Portfolio
16.2.3.3 Demographic Reach and Achievements
16.2.3.4 Certifications
16.2.4 Apple Inc.
16.2.4.1 Company Overview
16.2.4.2 Product Portfolio
16.2.4.3 Demographic Reach and Achievements
16.2.4.4 Certifications
16.2.5 Intel Corporation
16.2.5.1 Company Overview
16.2.5.2 Product Portfolio
16.2.5.3 Demographic Reach and Achievements
16.2.5.4 Certifications
16.2.6 Others
17 Key Trends and Developments in the Market
Additional Customisations Available
1 Manufacturing Process
1.1 Overview
1.2 Detailed Process Flow
1.3 Operation Involved
List of Key Figures and Tables
1. Global Flip Chip Market: Key Industry Highlights, 2018 and 2032
2. Global Flip Chip Historical Market: Breakup by Packaging Technology (USD Billion), 2018-2023
3. Global Flip Chip Market Forecast: Breakup by Packaging Technology (USD Billion), 2024-2032
4. Global Flip Chip Historical Market: Breakup by Bumping Technology (USD Billion), 2018-2023
5. Global Flip Chip Market Forecast: Breakup by Bumping Technology (USD Billion), 2024-2032
6. Global Flip Chip Historical Market: Breakup by Industry Vertical (USD Billion), 2018-2023
7. Global Flip Chip Market Forecast: Breakup by Industry Vertical (USD Billion), 2024-2032
8. Global Flip Chip Historical Market: Breakup by Region (USD Billion), 2018-2023
9. Global Flip Chip Market Forecast: Breakup by Region (USD Billion), 2024-2032
10. North America Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
11. North America Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
12. Europe Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
13. Europe Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
14. Asia Pacific Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
15. Asia Pacific Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
16. Latin America Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
17. Latin America Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
18. Middle East and Africa Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
19. Middle East and Africa Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
20. Global Flip Chip Market Structure
Key Questions Answered in the Report
The global flip chip market attained a value of nearly USD 31.37 billion in 2023.
The market is projected to grow at a CAGR of 6.1% in the forecast period of 2024-2032.
The market is estimated to witness a healthy growth in the forecast period of 2024-2032 to reach about USD 53.34 billion by 2032.
The major market drivers include the growing demand for low-cost and miniature silicon packaging in electronic devices and the rising penetration of advanced packaging solutions in electronics.
The growing utilisation of copper pillar bumping technology and increasing R&D activities by leading companies are the key trends fuelling the market growth.
The major regional markets for flip chip are North America, Latin America, the Asia Pacific, Europe, and the Middle East and Africa.
The different packaging technologies considered in the market report are 3D IC, 2.5D IC, and 2D IC.
Copper pillar, solder bumping, and gold bumping, among others, are the various bumping technologies included in the market report.
The significant industry verticals considered in the market report are electronics, industrial, healthcare, automotive and transport, IT and telecommunication, and aerospace and defence, among others.
The major players in the market are 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., and Intel Corporation, among others.
Analyst Review
The global flip chip market attained a value of about USD 31.37 billion in 2023, driven by the deployment of flip chip technology in silicon packaging. Aided by emerging copper pillar bumping technology, the market is expected to grow at a CAGR of 6.1% in the forecast period of 2024-2032 to reach nearly USD 53.34 billion by 2032.
EMR’s meticulous research methodology delves deep into the market covering the macro and micro aspects of the industry. On the basis of packaging technology, the market can be segmented into 3D IC, 2.5D IC, and 2D IC. Based on bumping technology, the market is divided into copper pillar, solder bumping, and gold bumping, among others. The market segmentations based on industry vertical are electronics, industrial, healthcare, automotive and transport, IT and telecommunication, and aerospace and defence, among others. The major regional markets for flip chip are North America, Latin America, the Asia Pacific, Europe, and the Middle East and Africa. They key players in the industry are 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., and Intel Corporation, among others.
EMR’s research methodology uses a combination of cutting-edge analytical tools and the expertise of their highly accomplished team, thus providing their customers with market insights that are accurate, actionable and help them remain ahead of their competition.
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