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Global Flip Chip Market Size, Share, Trends, Growth, Report: By Packaging Technology: 3D IC, 2.5D IC, 2D IC; By Bumping Technology: Copper Pillar, Solder Bumping, Gold Bumping, Others; By Industry Vertical: Electronics, Industrial, Healthcare, Automotive and Transport, Others; Regional Analysis; Competitive Landscape; 2024-2032

Global Flip Chip Market Size

The global flip chip market reached approximately USD 31.37 billion in 2023. The market is projected to grow at a CAGR of 6.1% between 2024 and 2032, reaching a value of around USD 53.34 billion by 2032.

 

Flip Chip Market Outlook

  • The need for smaller, more powerful electronic devices is a significant driver of flip chip technology.
  • Innovations in materials, bumping processes, and packaging techniques are driving the adoption of flip-chip technology.
  • The Asia Pacific region, with its strong semiconductor manufacturing base, plays a pivotal role in the global flip chip market.

 

Flip Chip Market Report Snapshots

Flip Chip Market Size

Flip Chip Market Growth

Flip Chip Market Trends

Flip Chip Market Share

Flip Chip Companies

Flip Chip Market Regional Analysis

 

*At Expert Market Research, we strive to always give you current and accurate information. The numbers depicted in the description are indicative and may differ from the actual numbers in the final EMR report.

1    Preface
2    Report Coverage – Key Segmentation and Scope
3    Report Description

    3.1    Market Definition and Outlook
    3.2    Properties and Applications
    3.3    Market Analysis
    3.4    Key Players
4    Key Assumptions
5    Executive Summary

    5.1    Overview
    5.2    Key Drivers
    5.3    Key Developments
    5.4    Competitive Structure
    5.5    Key Industrial Trends
6    Snapshot
    6.1    Global
    6.2    Regional
7    Opportunities and Challenges in the Market
8    Global Flip Chip Market Analysis

    8.1    Key Industry Highlights
    8.2    Global Flip Chip Historical Market (2018-2023) 
    8.3    Global Flip Chip Market Forecast (2024-2032)
    8.4    Global Flip Chip Market by Packaging Technology
        8.4.1    3D IC
            8.4.1.1    Historical Trend (2018-2023)
            8.4.1.2    Forecast Trend (2024-2032)
        8.4.2    2.5D IC
            8.4.2.1    Historical Trend (2018-2023)
            8.4.2.2    Forecast Trend (2024-2032)
        8.4.3    2D IC
            8.4.3.1    Historical Trend (2018-2023)
            8.4.3.2    Forecast Trend (2024-2032)
    8.5    Global Flip Chip Market by Bumping Technology
        8.5.1    Copper Pillar
            8.5.1.1    Historical Trend (2018-2023)
            8.5.1.2    Forecast Trend (2024-2032)
        8.5.2    Solder Bumping
            8.5.2.1    Historical Trend (2018-2023)
            8.5.2.2    Forecast Trend (2024-2032)
        8.5.3    Gold Bumping
            8.5.3.1    Historical Trend (2018-2023)
            8.5.3.2    Forecast Trend (2024-2032)
        8.5.4    Others
    8.6    Global Flip Chip Market by Industry Vertical
        8.6.1    Electronics
            8.6.1.1    Historical Trend (2018-2023)
            8.6.1.2    Forecast Trend (2024-2032)
        8.6.2    Industrial
            8.6.2.1    Historical Trend (2018-2023)
            8.6.2.2    Forecast Trend (2024-2032)
        8.6.3    Healthcare
            8.6.3.1    Historical Trend (2018-2023)
            8.6.3.2    Forecast Trend (2024-2032)
        8.6.4    Automotive and Transport
            8.6.4.1    Historical Trend (2018-2023)
            8.6.4.2    Forecast Trend (2024-2032)
        8.6.5    IT and Telecommunication
            8.6.5.1    Historical Trend (2018-2023)
            8.6.5.2    Forecast Trend (2024-2032)
        8.6.6    Aerospace and Defence
            8.6.6.1    Historical Trend (2018-2023)
            8.6.6.2    Forecast Trend (2024-2032)
        8.6.7    Others    
    8.7    Global Flip Chip Market by Region
        8.7.1    North America
            8.7.1.1    Historical Trend (2018-2023) 
            8.7.1.2    Forecast Trend (2024-2032)
        8.7.2    Europe
            8.7.2.1    Historical Trend (2018-2023) 
            8.7.2.2    Forecast Trend (2024-2032)
        8.7.3    Asia Pacific
            8.7.3.1    Historical Trend (2018-2023) 
            8.7.3.2    Forecast Trend (2024-2032)
        8.7.4    Latin America
            8.7.4.1    Historical Trend (2018-2023) 
            8.7.4.2    Forecast Trend (2024-2032)
        8.7.5    Middle East and Africa
            8.7.5.1    Historical Trend (2018-2023) 
            8.7.5.2    Forecast Trend (2024-2032)
9    North America Flip Chip Market Analysis
    9.1    United States of America 
        9.1.1    Historical Trend (2018-2023) 
        9.1.2    Forecast Trend (2024-2032)
    9.2    Canada
        9.2.1    Historical Trend (2018-2023) 
        9.2.2    Forecast Trend (2024-2032)
10    Europe Flip Chip Market Analysis
    10.1    United Kingdom
        10.1.1    Historical Trend (2018-2023) 
        10.1.2    Forecast Trend (2024-2032)
    10.2    Germany
        10.2.1    Historical Trend (2018-2023) 
        10.2.2    Forecast Trend (2024-2032)
    10.3    France
        10.3.1    Historical Trend (2018-2023) 
        10.3.2    Forecast Trend (2024-2032)
    10.4    Italy
        10.4.1    Historical Trend (2018-2023) 
        10.4.2    Forecast Trend (2024-2032)
    10.5    Others
11    Asia Pacific Flip Chip Market Analysis
    11.1    China
        11.1.1    Historical Trend (2018-2023) 
        11.1.2    Forecast Trend (2024-2032)
    11.2    Japan
        11.2.1    Historical Trend (2018-2023) 
        11.2.2    Forecast Trend (2024-2032)
    11.3    India
        11.3.1    Historical Trend (2018-2023) 
        11.3.2    Forecast Trend (2024-2032)
    11.4    ASEAN
        11.4.1    Historical Trend (2018-2023) 
        11.4.2    Forecast Trend (2024-2032)
    11.5    Australia
        11.5.1    Historical Trend (2018-2023) 
        11.5.2    Forecast Trend (2024-2032)
    11.6    Others
12    Latin America Flip Chip Market Analysis
    12.1    Brazil
        12.1.1    Historical Trend (2018-2023) 
        12.1.2    Forecast Trend (2024-2032)
    12.2    Argentina
        12.2.1    Historical Trend (2018-2023) 
        12.2.2    Forecast Trend (2024-2032)
    12.3    Mexico
        12.3.1    Historical Trend (2018-2023) 
        12.3.2    Forecast Trend (2024-2032)
    12.4    Others
13    Middle East and Africa Flip Chip Market Analysis
    13.1    Saudi Arabia
        13.1.1    Historical Trend (2018-2023) 
        13.1.2    Forecast Trend (2024-2032)
    13.2    United Arab Emirates
        13.2.1    Historical Trend (2018-2023) 
        13.2.2    Forecast Trend (2024-2032)
    13.3    Nigeria
        13.3.1    Historical Trend (2018-2023) 
        13.3.2    Forecast Trend (2024-2032)
    13.4    South Africa
        13.4.1    Historical Trend (2018-2023) 
        13.4.2    Forecast Trend (2024-2032)
    13.5    Others
14     Market Dynamics
    14.1    SWOT Analysis
        14.1.1    Strengths
        14.1.2    Weaknesses
        14.1.3    Opportunities
        14.1.4    Threats
    14.2    Porter’s Five Forces Analysis
        14.2.1    Supplier’s Power
        14.2.2    Buyer’s Power
        14.2.3    Threat of New Entrants
        14.2.4    Degree of Rivalry
        14.2.5    Threat of Substitutes
    14.3    Key Indicators for Demand
    14.4    Key Indicators for Price
15    Value  Chain Analysis
16    Competitive Landscape

    16.1    Market Structure
    16.2    Company Profiles
        16.2.1     3M Company
            16.2.1.1    Company Overview
            16.2.1.2    Product Portfolio
            16.2.1.3    Demographic Reach and Achievements
            16.2.1.4    Certifications
        16.2.2    Advanced Micro Devices, Inc.
            16.2.2.1    Company Overview
            16.2.2.2    Product Portfolio
            16.2.2.3    Demographic Reach and Achievements
            16.2.2.4    Certifications
        16.2.3    Amkor Technology, Inc.
            16.2.3.1    Company Overview
            16.2.3.2    Product Portfolio
            16.2.3.3    Demographic Reach and Achievements
            16.2.3.4    Certifications
        16.2.4    Apple Inc.
            16.2.4.1    Company Overview
            16.2.4.2    Product Portfolio
            16.2.4.3    Demographic Reach and Achievements
            16.2.4.4    Certifications
        16.2.5    Intel Corporation
            16.2.5.1    Company Overview
            16.2.5.2    Product Portfolio
            16.2.5.3    Demographic Reach and Achievements
            16.2.5.4    Certifications
        16.2.6    Others
17    Key Trends and Developments in the Market

 

Additional Customisations Available

1    Manufacturing Process
    1.1    Overview
    1.2    Detailed Process Flow
    1.3    Operation Involved

 

List of Key Figures and Tables

1.    Global Flip Chip Market: Key Industry Highlights, 2018 and 2032
2.    Global Flip Chip Historical Market: Breakup by Packaging Technology (USD Billion), 2018-2023
3.    Global Flip Chip Market Forecast: Breakup by Packaging Technology (USD Billion), 2024-2032
4.    Global Flip Chip Historical Market: Breakup by Bumping Technology (USD Billion), 2018-2023
5.    Global Flip Chip Market Forecast: Breakup by Bumping Technology (USD Billion), 2024-2032
6.    Global Flip Chip Historical Market: Breakup by Industry Vertical (USD Billion), 2018-2023
7.    Global Flip Chip Market Forecast: Breakup by Industry Vertical (USD Billion), 2024-2032
8.    Global Flip Chip Historical Market: Breakup by Region (USD Billion), 2018-2023
9.    Global Flip Chip Market Forecast: Breakup by Region (USD Billion), 2024-2032
10.    North America Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
11.    North America Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
12.    Europe Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
13.    Europe Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
14.    Asia Pacific Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
15.    Asia Pacific Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
16.    Latin America Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
17.    Latin America Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
18.    Middle East and Africa Flip Chip Historical Market: Breakup by Country (USD Billion), 2018-2023
19.    Middle East and Africa Flip Chip Market Forecast: Breakup by Country (USD Billion), 2024-2032
20.    Global Flip Chip Market Structure

Key Questions Answered in the Report

The global flip chip market attained a value of nearly USD 31.37 billion in 2023.

The market is projected to grow at a CAGR of 6.1% in the forecast period of 2024-2032.

The market is estimated to witness a healthy growth in the forecast period of 2024-2032 to reach about USD 53.34 billion by 2032.   

The major market drivers include the growing demand for low-cost and miniature silicon packaging in electronic devices and the rising penetration of advanced packaging solutions in electronics.

The growing utilisation of copper pillar bumping technology and increasing R&D activities by leading companies are the key trends fuelling the market growth.

The major regional markets for flip chip are North America, Latin America, the Asia Pacific, Europe, and the Middle East and Africa.

The different packaging technologies considered in the market report are 3D IC, 2.5D IC, and 2D IC.

Copper pillar, solder bumping, and gold bumping, among others, are the various bumping technologies included in the market report.

The significant industry verticals considered in the market report are electronics, industrial, healthcare, automotive and transport, IT and telecommunication, and aerospace and defence, among others.

The major players in the market are 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., and Intel Corporation, among others.

Analyst Review

The global flip chip market attained a value of about USD 31.37 billion in 2023, driven by the deployment of flip chip technology in silicon packaging. Aided by emerging copper pillar bumping technology, the market is expected to grow at a CAGR of 6.1% in the forecast period of 2024-2032 to reach nearly USD 53.34 billion by 2032.

 

EMR’s meticulous research methodology delves deep into the market covering the macro and micro aspects of the industry. On the basis of packaging technology, the market can be segmented into 3D IC, 2.5D IC, and 2D IC. Based on bumping technology, the market is divided into copper pillar, solder bumping, and gold bumping, among others. The market segmentations based on industry vertical are electronics, industrial, healthcare, automotive and transport, IT and telecommunication, and aerospace and defence, among others. The major regional markets for flip chip are North America, Latin America, the Asia Pacific, Europe, and the Middle East and Africa. They key players in the industry are 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., and Intel Corporation, among others.

 

EMR’s research methodology uses a combination of cutting-edge analytical tools and the expertise of their highly accomplished team, thus providing their customers with market insights that are accurate, actionable and help them remain ahead of their competition.

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