Global Flip Chip Market to Grow at a CAGR of 6.10% During 2026-2035, Driven by the Deployment of Flip Chip in the Automotive Industry

The deployment of flip chip technology in electronic devices that aids in miniaturisation and boosts performance is robustly driving the industry growth.  Due to the increasing demand for compact designs and the complex functioning of automotive vehicles, the flip chip industry is robustly rising. In addition, with the emergence of electronic vehicles, there has been a significant rise in high technology packaging, which is aiding the market growth. The market is thus, being driven by the application of packaging technology in a variety of products, including engines, infotainment components, and the body of the vehicle. Furthermore, with diminished uses of wire, the manufacturers are able to provide sleek designs and reduce the risks associated with working with wires, hence invigorating the market growth. Advanced technological packaging to enhance reliability and provide high electrical performance is also propelling industry growth of the flip chip technology.

The market is being aided by the ongoing technological advancements by the companies in the industry like 3M Company (NYSE: MMM) and Infineon. The latter company became the first firm to provide manufacturing set up for flip chip technology packages that are fully geared to the high-quality requirements of the automotive market in January 2020. Due to the reduction in space availability, especially in camera and radar systems, the demand for compact power supply solutions is increasing. The new linear voltage regulator that operates on flip chip packaging technology designed by Infineon is about 60% smaller than that of an established reference product and provides the same thermal resistance. This makes the device suitable for applications with space constraints. The new linear voltage regulator is highly efficient for automotive as it addresses the problem of space restrictions with the use of flip chip technology. Such innovations are augmenting the market growth of flip chip technology.

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Market Analysis by Packaging Technology, Bumping Technology, Industry Vertical, and Region:

• On the basis of packaging technology, the market can be broadly categorised into 3D IC, 2.5D IC and 2D IC.
• Based on bumping technology, the market is divided into copper pillar, solder bumping, and gold bumping, among others.
• The market segmentations based on industry vertical are electronics, industrial, healthcare, automotive and transport, IT and telecommunication, and aerospace and defence, among others.
• The major regional markets for flip chip are North America, Latin America, Europe, the Asia Pacific, and the Middle East and Africa.

Key Findings of the Report:

• The market is being driven by the rising demand for miniaturisation and high-performance packaging in electronic devices.
• Extensive deployment of silicon technology, owing to low costs, is resulting in a surging demand for scalable and tolerant optical interfacing methods based on flip chip bonding, which in turn, is bolstering the market growth.
• The copper pillar bumping technology that can significantly reduce costs and lower power consumption is anticipated to drive the industry growth in the forecast period.
• The emergence of flip chip packaging technology in healthcare equipment like invasive sensors is bolstering the market growth of the overall flip chip industry.
• The deployment of flip chip packaging technology in electronic automotive vehicles for enhanced performance and space reduction is boosting the industry growth.

Key Offerings of the Report:

• The EMR report gives an overview of the global flip chip industry for the periods (2019-2025) and (2026-2035).
• The report also offers historical (2019-2025) and forecast (2026-2035) markets for packaging technologies, bumping technologies, industry verticals, and regions of flip chip.
• The report analyses market dynamics, covering the key demand and price indicators in the market along with an assessment of the SWOT and Porter’s Five Forces Model.

Top Players:

The major players in the global flip chip market are:

• 3M Company   
• Advanced Micro Devices, Inc.
• Amkor Technology, Inc.
• Apple Inc.
• Intel Corporation
• Others

The comprehensive report by EMR looks into the market share, capacity, and latest developments like mergers and acquisitions, plant turnarounds, and capacity expansions of the major players.

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