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The deployment of flip chip technology in electronic devices that aids in miniaturisation and boosts performance is robustly driving the industry growth. Due to the increasing demand for compact designs and the complex functioning of automotive vehicles, the flip chip industry is robustly rising. In addition, with the emergence of electronic vehicles, there has been a significant rise in high technology packaging, which is aiding the market growth. The market is thus, being driven by the application of packaging technology in a variety of products, including engines, infotainment components, and the body of the vehicle. Furthermore, with diminished uses of wire, the manufacturers are able to provide sleek designs and reduce the risks associated with working with wires, hence invigorating the market growth. Advanced technological packaging to enhance reliability and provide high electrical performance is also propelling industry growth of the flip chip technology.
The market is being aided by the ongoing technological advancements by the companies in the industry like 3M Company (NYSE: MMM) and Infineon. The latter company became the first firm to provide manufacturing set up for flip chip technology packages that are fully geared to the high-quality requirements of the automotive market in January 2020. Due to the reduction in space availability, especially in camera and radar systems, the demand for compact power supply solutions is increasing. The new linear voltage regulator that operates on flip chip packaging technology designed by Infineon is about 60% smaller than that of an established reference product and provides the same thermal resistance. This makes the device suitable for applications with space constraints. The new linear voltage regulator is highly efficient for automotive as it addresses the problem of space restrictions with the use of flip chip technology. Such innovations are augmenting the market growth of flip chip technology.
Market Analysis by Packaging Technology, Bumping Technology, Industry Vertical, and Region:
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The major players in the global flip chip market are 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., and Intel Corporation, among others. The comprehensive report by EMR looks into the market share, capacity, and latest developments like mergers and acquisitions, plant turnarounds, and capacity expansions of the major players.
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